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Printed Wiring Board
OPC H-TEC CONDICLEAN WA-1
OPC H-TEC CONDICLEAN WA-1
Promote catalyst adsorption on hole wall, resin, glass fiber
Can omit anionic pre-dipping step
High connection reliability with inner copper foils
Prevent foaming by agitation or bath circulation
Conditioner
Printed Wiring Board
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「OPC H-TEC PROCESS NEX」
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