Can obtain uniform brightness, high levelling power at wide current density areas Great ductility, second-processing is possible Suitable for underlying nickel plating films for PWB
Can obtain uniform brightness, levelling performance at wide current density areas Great ductility Reduce bad effect on film properties by excessive addition Easy bath control
Copper paste for plating seed layer by screen printing Can use by low-temperature curing in air Excellent in deposition of electroless plating Achieve high adhesion between substrates and plating films
Catalyzing Agent
General plastics, Polyethylene terephthalate(PET), Polyimide(PI)
Neutral type electroless gold plating solution Sulfite based, cyanide free product High deposition performance on high P content electroless nickel plating films High deposition performance on palladium plating films
Strong cleaning power to shorten treatment time Prevent discoloration of copper and brass by alkali Prevent excessive dissolution of zinc Easily washed off Not containing endocrine disrupting chemicals
Treatment Chemical for Copper and Its AlloysSoak Cleaner
Use as electro-cleaner for copper, brass lead frames Strong cleaning power, no damage substrates Chelating-agent free product Easy wastewater treatment
Treatment Chemical for Copper and Its AlloysElectrolytic Cleaner
Dense zincate films can be obtained. High coverage of electroless nickel plating and uniform appearance is obtained Excellent in plating adhesion strength Less dissolution of aluminum, best for thin aluminum electrodes
Low erosion, maintain the brightness of aluminum electrodes Excellent degreasing and cleaning power Provide wettability to aluminum surfaces Low foaming, can use air agitation and spray
Sn-Cu alloy plating bath, not containing lead Can use as lead free solder plating Can obtain stable alloy ratio at wide current density areas (Cu content:1 to 2% by weight)
Various Electroplating ChemicalTin-Copper Allloy Plating
Tin-copper alloy plating bath, not containing lead Can use as lead free solder plating Can obtain stable alloy ratio at wide current density areas (Cu content:1 to 2% by weight)
Various Electroplating ChemicalTin-Copper Allloy Plating
Lead-free, tin-copper films can be obtained Can use as the replacement of lead-based solder plating Can obtain stable alloy ratio (Cu content: 1 to 2 % by weight) at wide current density areas
Various Electroplating ChemicalTin-Copper Allloy Plating
Immersion-type electroless silver plating solution for copper Acidic bath, deposition rate 0.2μm/15min No voids between copper and silver Can obtain high adhesion silver films High bath stability
High deposition performance, great adheison to LCP Flat and smooth films come available, prevent blisters and peel-off High bath stability, a long bath life
Uniform palladium adsorption power to LCP Alkaline-product, prevent haloing more strongly than acidic-type High penetrating performance to small-diameter holes
For steel, alloy 42, lead frames, hoop substrates and general cleaning Alkaline-type product Containing phosphorus, not make silicate films Low COD product
Treatment Chemical for Steel and Alloy 42 MaterialsSoak Cleaner
Lead-free product High deposition performance High film hardness is available without heat treatment The most suitable for electronic components and ceramics Can use continuously by replenishing (B content: 0.2 to 0.6% by weight)
Lead-free electroless nickel-phosphorus plating solution Excellent in fine pattern forming performance High solder wettability and solder joint strength Can use at 65℃, best for MID P content: 5% by weight
Electroless Plating Process Chemical for MIDElectroless Nickel Plating Solution
Electroless copper plating solution for MID Cyanide-free, EDTA-based product for strike plating High pattern selectivity, great deposition performance Applicable to MID by LDS structure
Electroless Plating Process Chemical for MIDAlkaline Cleaner
Electroless copper plating solution for MID Cyanide-free, EDTA-based product High bath stability, high speed plating is possible (5μm/h) High selectivity to copper
Electroless Plating Process Chemical for MIDElectroless Copper Plating Solution
Can obtain semi-bright bismuth-antimony alloy plating films (Sb content: 5 to 10 mass%) Higher film hardness and sliding performance than bismuth plating films
Acid copper plating additive for semiconductor High filling poerformance to blind via hole Applicabler to treanch filling High filling performance by small thickness
Immersion-reduction type electroless gold plating solution Prevent the corrosion of the underlying nickel plating films For low phosphorus and medium phosphorus type electroless Ni-P plating Dense plating films is obtained over nickel and palladium plating films High solder wettability and solder joint strength, excellent in gold wire bondability
Immersion-type electroless gold plating solution For middle-phosphorus type nickel plating films Reduce the corrosion of base nickel plating films Dense gold plating films can be formed High solder wettability and solder joint strength
Cyanide-free, neutral type electroless palladium plating solution Palladium purity over 99wt% (P content:below 1%) can be obtained Dense palladium plating films can be obtained without damaging underlying nickel plating films Excellent solderability and gold wire bondability by nickel/palladium/gold plating films
Sulfur-free, low phosphorus type (P content: 1.5 to 2.5 % by weight) electroless Ni-P plating solution Suitable for power semiconductors that require high temperature bonding and regular use at high temperatures. Excellent crack resistance and less film embrittlement even after heat treatment over 400°C
Sulfur-free low phosphorus type electroless nickel solution For power semiconductors that require high-temperature bonding For power semiconductors that are used at high temperatures Excellent crack resistance even after heat treatment at 300 to 350°C Minimal degradation of solder wettability over time (P content:2-3wt%)
Strongly remove fingerprints, oil, rust from copper surface Acidic-type, have cleaning power with etching effect Not containing PFAS, endocrine disrupting chemicals
Can use for the substrates that are weak to allkali Easily remove foams after cleaning Can use at a lower temperature to save energy cost Not containing PFAS, endocrine disrupting chemicals
The OPC FLET process is an electroless copper plating process that is compatible with semi-additive methods. It has excellent uniform deposition on the material surface and inside via holes, reduces circuit width narrowing during flash etching, and also suppresses precipitation on copper, achieving crystal continuity between inner layer copper and upper layer plating copper. This process is ideal for forming fine patterns and micro via holes on IC substrates, suppressing the generation of voids.
The OPC FLET-S process is an electroless copper plating process suitable for the subtractive method, MSAP. Excellent for uniform deposition on the material surface, via holes, and through holes, reducing circuit width narrowing during flash etching, and suppressing precipitation on copper, resulting in continuous crystal formation between inner layer copper and upper layer plating copper This is the optimum process for improving reliability by realizing reliability.
Via filling additive that enables high current density plating in fine-pattern PWBs Ideal for large diameter vias of PWBs due to its excellent filling performance
Via filling additive that enables high current density processing for fine pattern PWBs Ideal for pattern plating of build-up layers where uniformity of film thickness is important Plating by vertical conveyor continuous plating system at 2~3 A/dm2 is possible
High throwing power, suitable for high-aspect-ratio substrates Excellent via covering power for PCB with via- and through-holes Can use phosphorus-containing copper anodes and insoluble anodes
Improve covering performance into through and via holes Excellent in penetration power into small holes Suitable for horizontal conveyance plating system (Batch treatment is possible)
Use after OPC-1200 EPOETCH step Strongly clean etched surface of epoxy resin Excellent in permeability to small holes and areas Not containing PFOS, PFOA, endocrine disrupting chemicals
Use with OPC-1200 EPOETCH, sodium permanganate based solution Can use for de-smear to clean inner copper foils Make concave and convex surfaces finely on epoxy resin
High folding endurance Deposition rate 12μm/h (P content: 7 to 11% by weight) Prevent blackening and corrosion after stripping immersion gold plating Excellent in solder wet and solder joint performance Fine pattern and semi-bright appearance can be obtained
Cleaning and conditioning epoxy surface after micro-etching Strong permeability into micro-holes and small areas Low-foaming, can use de-smear equipment by conveyance system
Reduce time for roller maintenance from acid-type catalyst process Excellent permeability into small holes Can shorten treatment time Strong adsorbing power of catalysts to PWBs Reduce Pd concentration at the time of initial make-up to 50%
Neutral-type cleaner Remove oxidized films and resist residues from copper surface Improve wettability, high cleaning power Can be washed easily by water rinse Not containing PFOS, PFOA, endocrine disrupting chemicals
Reduce damage to copper substrate Strongly remove organic and inorganic dirt by spray or immersion Strongly remove protective films, solder resists, dry films and various residues Can use for pretreatment before electroplating Can use at a low temperature to save energy costs Not containing PFOS, PFOA, endocrine disrupting chemicals
Use after OPC-1200 EPOETCH step Strongly clean etched surface of epoxy resin Excellent in permeability to small holes and areas Not containing PFOS, PFOA, endocrine disrupting chemicals
Promote catalyst adsorption evenly High deposition performance to substrates that can't be plated easily Weak alkaline based, can use for substrates that can't be treated by alkali Excellent permeability into small-diameter blind via holes High cleaning performance to copper foils
High covering performance, uniform deposition by small thickness Deposition rate 0.15μm/2min Excellent in fine patterning formation performance High solder joint, high gold wire bonding performance
Selectively remove copper sputtering films Neutral type bath, prevent pattern width reduction Suppresse the increase in circuit surface roughness Control undercut Spray treatment is recommended
Promote catalyst adsorption on hole wall, resin, glass fiber Can omit anionic pre-dipping step High connection reliability with inner copper foils Prevent foaming by agitation or bath circulation
Stabilize catalyst adsorption in alkaline-ionic catalyzing step Give wettability, improve penetrating performance into small-diameter holes Control the amount of residues on copper High connection reliability with inner foils
High connecting reliability with inner copper foil and plated copper Can obtain copper film with small thickness stably Great deposition performance into via-, through-holes High adhesion power on low Ra materials, prevent blisters High purity copper is available Low sheet resistance is possible even by small thickness
Acidic treatment agent to prevent deposition of electroless nickel plating into non-conductive holes in PWB Prevent electroless nickel deposition out of patterns
Electroless copper plating solution, rochelle salt based Can obtain smooth and bright appearances Suitable for rolled copper foils to prevent nodules after acid copper plating
Reduce damage to nickel films Fine and uniform film appearance can be obtained High solder wettability and solder joint strength Can use at a low temperature (0.06μm/10min at 80℃)
Use as pretreatment for isolated circuit patterns Use after accelerating step Prevent electroless nickel deposition out of patterns Excellent in fine pattern formation performance
For pretreatment to isolated circuit patterns Use after Pd acceleration to remove palladium from surfaces High selectivity only to copper electrodes Excellent in fine pattern formation performance
Auto-catalytic type electroless palladium plating solution Palladium purity over 99％ (P content below 1%) is possible Great bath stability, tolerant against dragged-in impurities High solder-joint and heat-resistant gold wire bonding performance can be obtained after immersion gold plating on PALLATOP LP film Neutral bath, reduce damage to substrates Cyanide-free products
High solder wettability, solder joint strength and gold wire bonding performance Best product for electroless Ni-P/Pd/Au process Stable deposition performance, can obtain uniform deposits on palladium films High deposition performance (0.1μm/25min, on 0.1μm of palladium film) Prevent base film corrosion
Use for electroless copper plating by horizontal conveyance system Cyanide-free, rochelle salt based product Can show high deposition performance quickly High bath stability, not cause bristers on low surface roughness substrates
Use for electroless plating, rochelle salt based Excellent in covering performance into via-holes Low residual stress Prevent blisters to low surface-roughness substrates
Use as via-filling, also applicable to through- and pattern-plating Void occurrance can be prevented very strongly Can use for via-holes from 30 to 130μm
Acid copper plating additive for via-filling and through hole plating Can realize high throwing power and great via-filling performance at the same time High ductility, bright appearances, great thermal-shock resistance come available Applicable to subtractive costruction method and M-SAP
For via-hole filling in wide current density areas Also excellent in deposition performance into through-holes Only for phosphorus content copper anodes
Use with OPC-1200 EPOETCH, sodium permanganate based solution Can use for de-smear to clean inner copper foils Make concave and convex surfaces finely on epoxy resin
Hydrogen-peroxide and sulfuric acid based Can replenish sulfuric acid, economical product Maintain etching performance from initial make-up to renewal time
High filling performance even in horizontal R to R equipment Solve the problem of reduced filling performaance due to weak current generated between the copper sulfate plating tank and the conveyyaance rollers
Wet-, Plating-Process Chemical for Polyimide Films Applicable to FCCL
Cyanide-free, EDTA based product Excellent deposition performance on silver Can omit palladium activating step Also applicable to continuous conveyance system
An electroless copper plating process that achieves high adhesion on glass, which is a candidate for interposer substrate for semiconductor packages The Liquid Phase Deposition (LPD) method is used to form an adhesion layer of metal oxide Ensures high adhesion between electroless copper plating and glass substrates, and can be used for high-speed communication systems in 5G and 6G era
