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Printed Wiring Board
OPC H-TEC COPPER
OPC H-TEC COPPER
Use for electroless copper plating by horizontal conveyance system
Cyanide-free, rochelle salt based product
Can show high deposition performance quickly
High bath stability, not cause bristers on low surface roughness substrates
Electroless Copper Plating Solution
Printed Wiring Board
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「OPC H-TEC PROCESS NEX」
Total process solutions
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