TOP LUCINA GCS TF

• Acid copper plating additive for through-hole filling for glass subustates.
  Acid copper plating additive for pulse electrolysis, ideal for high-aspect-ratio through-hole filling
  Strongly suppress the deposition near hole opening and prevent voids
  Additive performance is stable, realize high-quality plating
• For Through-hole Filling Plating
• Printed Wiring Board