TOP LUCINA GCS PR

• Acid copper plating additive for through-hole filling for glass substrates.
  Pre-filling additive for acid copper plating before through-hole filling
  It fills the inside of the hole with copper, greatly reducing the risk of voids in the next filling plating process.
  Even when using pulse electrolytic plating, it maintains a lustrous appearance over a wide range of electrolytic conditions.
• For Through-hole Filling Plating
• Printed Wiring Board