OPC FLET-S PROCESS

• The OPC FLET-S process is an electroless copper plating process suitable for the subtractive method, MSAP. Excellent for uniform deposition on the material surface, via holes, and through holes, reducing circuit width narrowing during flash etching, and suppressing precipitation on copper, resulting in continuous crystal formation between inner layer copper and upper layer plating copper This is the optimum process for improving reliability by realizing reliability.
• Process Chemicals for Subtractive Process/MSAP
• Printed Wiring Board

• Total process solutions