TORYZA FG SR

• Immersion-reduction type electroless gold plating solution
  Prevent the corrosion of the underlying nickel plating films
  For low phosphorus and medium phosphorus type electroless Ni-P plating
  Dense plating films is obtained over nickel and palladium plating films
  High solder wettability and solder joint strength, excellent in gold wire bondability
• Electroless Ni/(Pd)/Au Plating Process
  
  Electroless Gold Plating Solution
• Wafer