TORYZA FG 330

• Immersion-type electroless gold plating solution
  For middle-phosphorus type nickel plating films
  Reduce the corrosion of base nickel plating films
  Dense gold plating films can be formed
  High solder wettability and solder joint strength
• Electroless Ni/(Pd)/Au Plating Process
  
  Electroless Gold Plating Solution
• Wafer