TORYZA PD LP

• Cyanide-free, neutral type electroless palladium plating solution
  Palladium purity over 99wt% (P content:below 1%) can be obtained
  Dense palladium plating films can be obtained without damaging underlying nickel plating films
  Excellent solderability and gold wire bondability by nickel/palladium/gold plating films
• Electroless Ni/(Pd)/Au Plating Process
  
  Electroless Palladium Plating Solution
• Wafer