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ICP NICORON FPF-TM

  • High folding endurance
    Deposition rate 12μm/h (P content: 7 to 11% by weight)
    Prevent blackening and corrosion after stripping immersion gold plating
    Excellent in solder wet and solder joint performance
    Fine pattern and semi-bright appearance can be obtained
  • Electroless Ni-P/Au Plating Process

    Electroless Nickel Plating Solution
  • Printed Wiring Board