CHEMICAL NI IPT

• Alkaline-type electroless copper plating solution
  Can obtain high P content film (P content: 8 to 10%)
  High corrosion resistance
  Prevent nickel film dissolution aroung contact points
  Excellent in selective deposition performance
  Prevent the deposition to jigs
  Can decrease nickel concentration, economical product
• Alkaline Type Electroless Nickel Plating Solution
• ABS, PC/ABS

• Total process solutions