Use after etching step to reduce chromic acid remaining on resin surfaces Control the impact by chromic acid in catalyzing steps Make adsorption condition of catalysts uniform on resin surfaces
Plating on plastic process for decorative purpose Make palladium-tin colloids adsorbed on plastic surface To operate special conducting treatment, then conduct acid copper plating
Direct Acid Copper Plating Process
ABS, PC/ABS, General plastics, Polycarbonate(PC), Polyphenylene ether(PPE), Polyphenylene oxide(PPO)
Use only for replenishing to increase chemical nickel concentration Can reduce drag-out amount just after replenishing Effective in terms of wastewater treatment and production costs
Excellent in bath stability for a long time use High-speed deposition, film brightness can be maintained Not easily damaded by scratched, prevent burnt deposition
Additive for chromic acid-sulfuric acid etching bath Make adsorption state of catalysts uniform Improve deposition effect Strongly recommended for CRP PROCESS
Can decrease palladium concentration of catalysts Can use for a long time by replenishing Not containing formalin and strong complexing agents Easy wastewater treatment
Can reduce palladium consumption amount Can maintain tin (II) chloride within 50 to 60 g/L Uniform adsorption performance can be obtained High tolerance to chromic acid Easy bath control
Make copper immersion films uniformly on electroless- or strike electro-nickel films Promote smooth deposition of acid copper plating Prevent burnt deposits at contact points
Improve catalyst adsorption ability to plastic surface Make palladium catalysts adsorbed uniformly Improve the stability of deposition performance Tolerant against chromic acid drag-in
Alkaline-type electroless nickel plating solution Can obtain high P content film (P content: 8 to 10%) High corrosion resistance Prevent nickel film dissolution aroung contact points Excellent in selective deposition performance Prevent the deposition to jigs Can decrease nickel concentration, economical product
Alkaline-type electroless nickel plating solution for TOP ZECROM PLUS PROCESS Excellent in deposition reaction, prevent no-deposition defects High bath stability, a long bath life Lead-free
Alkaline-type electroless copper plating solution Can obtain high P content film (P content: 8 to 10%) High corrosion resistance Prevent nickel film dissolution aroung contact points Excellent in selective deposition performance Prevent the deposition to jigs Can decrease nickel concentration, economical product
Excellent leveling performance of acid-copper plating Improved continuity of conductive films Strong bath stability to prevent copper deposition on tanks, bath decomposition Can use for a long time by replenishing Not containing formaldehyde and strong chelating agents Improve working environment, easy wastewater treatment
Make palladium catalysts adsorbed uniformly in catalyzing steps Control excessive catalyst adsorption on plastic For ABS resin, conditioning steps become unnecessary Control palladium catalyst amount adsorbed on jigs
Alkaline-type electroless nickel plating solution Ammonia-free, excellent in corrosion resistance Prevent conductivity failure caused by no deposition on jigs Control electroplating film dissolution No need to increase the thickness of electroless nickel plating films (High P content, P content 8 to 10%)
Use after hydrophilization treatment by chemical etching Arrange reducing agents uniformly on resin surfaces Next, by activating treatment, catalysts will be adsorbed on resin by reducing reaction
Alkaline-type electroless nickel plating solution for TOP ZECROM PLUS PROCESS Excellent in deposition reaction, prevent no-deposition defects High bath stability, a long bath life Lead-free
Improve catalyst adsorption ability to plastic surface Make palladium catalysts adsorbed uniformly Improve the stability of deposition performance Tolerant against chromic acid drag-in
Alkaline ionic catalysts solution for CFRP Better adhesion performance than acidic catalysts can be obtained Excellent in deposition performance of electroless plating
