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PALLATOP LP

  • Auto-catalytic type electroless palladium plating solution
    Palladium purity over 99％ (P content below 1%) is possible
    Great bath stability, tolerant against dragged-in impurities
    High solder-joint and heat-resistant gold wire bonding performance can be obtained after immersion gold plating on PALLATOP LP film
    Neutral bath, reduce damage to substrates
    Cyanide-free products
  • Electroless Ni-P/Pd/Au Plating Process

    Electroless Palladium Plating Solution
  • Printed Wiring Board