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TOP SILVE ACC

  • Immersion-type electroless silver plating solution for copper
    Acidic bath, deposition rate 0.2μm/15min
    No voids between copper and silver
    Can obtain high adhesion silver films
    High bath stability
  • Electroless (Ni-P)/(Pd)/Ag Plating Process

    Electroless Silver Plating Solution
  • Copper alloy, Printed Wiring Board