ICP NICORON LTN(NP)

• Lead-free electroless nickel-phosphorus plating solution
  Excellent in fine pattern forming performance
  High solder wettability and solder joint strength
  Can use at 65℃, best for MID
  P content: 5% by weight
• Electroless Plating Process Chemical for MID
  
  Electroless Nickel Plating Solution
• Printed Wiring Board, Molded interconnect device(MID)