OPC COPPER MIC-BL
- Electroless copper plating solution for MID
Cyanide-free, EDTA-based product
High bath stability, high speed plating is possible (5μm/h)
High selectivity to copper - Electroless Plating Process Chemical for MIDElectroless Copper Plating Solution
- Printed Wiring Board, Molded interconnect device(MID)
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