TOP LUCINA NSV ADV

• Via filling additive that enables high current density processing for fine pattern PWBs
  Ideal for pattern plating of build-up layers where uniformity of film thickness is important
  Plating by vertical conveyor continuous plating system at 2~3 A/dm2 is possible
• For Via-filling Plating
• Printed Wiring Board

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  「TOP LUCINA NSV ADV」
• Total process solutions