Search
product

OPC COPASEED SCP

  • Copper paste for plating seed layer by screen printing
    Can use by low-temperature curing in air
    Excellent in deposition of electroless plating
    Achieve high adhesion between substrates and plating films
  • Catalyzing Agent
  • General plastics, Polyethylene terephthalate(PET), Polyimide(PI)