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Printed electronics technology to reduce environmental burden and improve productivity
OPC COPASEED SCP
We can connect computers, smartphones, smart watches, home appliances, automobiles to network from the benefit of IoT evolution. In such digital tools, the market of wearable devices and smart digital home appliances is expected to increase strongly. For the field, printed electronics is featured because the process enables to print circuit patterns on flexible materials such as PET and PP films directly.
To reply the demand, we have developed OPC COPASEED SCP as an eco-friendly process based on our long history in surface treatment and screen printing. By OPC COPASEED SCP, we can directly print seed layers for electroless copper plating on flexible films by screen printing.
Product features, specifications
Subtractive process using single-sided Flexible Copper Clad Laminates (FCCL）has prevailed in PCB production. Subtractive comes from the word of subtract in English, which means take something away from other things. Thus, laminated copper foils are removed by etching to draw circuit patterns in the subtractive process.
To reduce environmental burden and improve productivity, we have launched the new products, OPC COPASEED SCP (copper paste for screen printing) and OPC COPPER HFS (electroless copper plating solution).