TOP NICORON HFM-GE

• Middle P content, electroless Ni-P plating solution
  Maintain deposition rate regardless of bath aging
  Excellent in brightness, leveling
  Film stress is compressive
  Not containing Pb, Hg, Cd, Cr, Bi
  (P content: 6 to 9% by weight)
• Continuous Replenishing Type
• General metal