Can obtain cobalt-phosphorus-chromium alloy films Smoke color films can be obtained By combination with TOP FARBE COB-DIP2, black color films can be obtained
Excellent in corrosion-, chemical-resistance Excellent in anti-discoloration performance Small impact to film stress by bath aging High bendability, lead compound free (P content: high, 11 to 12% by weight)
Lead-free electroless Ni-Fe alloy plating solution Uniform alloy films (Fe content : 25％ by weight) can be obtained Excellent in shielding effect against low frequency magnetic waves Hardness:Hv700 (as deposited), Hv1050 (after heat treatment)
Can obtain uniform brightness and high levelling power at wide current density areas Great ductility, suitable for second processing Best for undercoat nickel plating
Plated films with several-micron micropores can be formed Maintain porous structures continuously, reduce the impact by current density Can form the porous films immediately, short-time plating is possible
Brighteners for semi-bright tin, semi-bright solder plating Work at wide current density areas Excellent in covering power at low current density areas
Can obtain Ni-P alloy plating films Show high corrosion-, chemical-resistance, excellent in wear resistance High bath stability, long bath life P content: 10 to 12mass%
Additive for sulfuric-acid base tin plating solution Use for rack and barrel plating Tin concentration range and brightness range are wide Excellent in uniformity, leveling performance Great soldering performance comes available
For batch application, lead-free product Excellent in deposition performance High film hardness without heat treatment Best for electronic components and ceramics
Lead-free product High deposition performance High film hardness is available without heat treatment The most suitable for electronic components and ceramics Can use continuously by replenishing (B content: below 0.2 to 0.6% by weight)
Lead compounds are not used High hardness (about Hv700) without heat treatment. P content is 1 to 2 % by weight Good wear resistance Long-term use is possible by replenishment method
Silicon carbide/nickel composite plating solution Low phosphorus type films come available (P content: 1 to 3％ by weight) Excellent in film hardness (Hv700 to 750) Excellent in wear resistance Higher film hardness can be obtained after heat treatment Can be used continuously Maintain almost the same film properties from an initial-make up time to 2, 3 MTO
Maintain deposition rate regardless of bath aging Excellent in brightness, leveling performance Inner stress is compressive Not use lead compounds Can use for a long time by cooling bath to remove impurities
Lead compound free Compliant with PFOS and PFOA regulations PTFE co-deposited amount: 7 to 13 % by volume Low coefficient of friction, excellent sliding properties Non-adhesiveness, excellent in mold releasing property High peelability, water repellency, and oil repellency Reduce dimple amount
Pb compound free PFOS, PFOA free product PTFE co-deposition content: 20 to 26% by volume Low coefficient of friction, high sliding performance Not adhesive film High mold-releasing, water repellent, oil repellent performance Can use for 2 to 3 MTO, maintain PTFE content
Pb compound free PFOS, PFOA free product PTFE co-deposition content: below 30 to 40% by volume Low coefficient of friction, high sliding performance Not adhesive film High mold-releasing, water repellent, oil repellent performance Can use for 1 to 2 MTO, maintain PTFE content
Electroless Ni-P/PTFE composite plating solution (P content:1 to 3 ％ by weight, PTFE co-deposition content: below 5% by volume) High hardness, Hv650 to 700 Pb compounds, PFOS, PFOA free product Low coefficient of friction, high sliding performance Not adhesive film High mold-releasing, water repellent, oil repellent performance Can use for 3MTO, maintain PTFE content
Middle P content, electroless Ni-P plating solution Maintain deposition rate regardless of bath aging Excellent in brightness, leveling Film stress is compressive Not containing Pb, Hg, Cd, Cr, Bi (P content: 6 to 9% by weight)
High P content, electroless Ni-P plating solution Excellent in chemical resistance, discoloration resistance Film stress is compressive Not containing Pb, Hg, Cd, Cr, Bi (P content: over 10% by weight)
Can obtain Ni-PTFE electroplating composite films (PTFE co-deposition content: maximum 60% by volume) PFOA, PFOS-free Can handle easily by adding watts nickel bath
Electroless Ni-P/PTFE co-deposition plating solution PTFE co-deposition content: 30 to 40% by volume,very high type Lead-free, PFOS, PFOA compound free product High sliding-, mold-releasing performance High water repellent performance
Electroless Ni-P/PTFE co-deposition plating solution PTFE co-deposition content: 6 to 13% by volume,middle type Lead-free, PFOS, PFOA compound free product High sliding-, mold-releasing performance High water repellent performance
Lead-free product from TOP NICORON TOM Excellent in covering performance Can maintain deposition speed and brightness in continuous use Improve working performance (P content: middle, 7 to 9% by weight)
Can maintain deposition speed in continuous use Excellent in corrosion-resistance and anti-discoloration performance (P content: middle, 8 to 10% by weight)
Excellent in corrosion-, chemical-resistance Excellent in anti-discoloration performance Reduce film stress increase even if MTO proceeds (P content: high, 11 to 12% by weight)
Excellent in corrosion-, chemical-resistance The most suitable for parts requiring non-magnetic property For non-magnetic purposes such as plating on resistors (P content: 12 to 13% by weight)
High P content, electroless Ni-P plating solution For non-magnetic property Little change by time lapse Great smoothness, high chemical resistance For thick plating (P content: 11 to 12% by weight)
Middle P type, electroless Ni-P plating solution Excellent in brightness, covering performance Can maintain brightness in continuous use (P content: 8 to 10% by weight)
Lead-free product from TOP NICORON TOM Excellent in covering performance Maintain deposition speed and brightness in continuous use Improve working performance (P content: 7 to 9% by weight)
Middle P content, electroless Ni-P plating solution Can maintain deposition speed in continuous use Excellent in corrosion-resistance and anti-discoloration performance (P content: 6 to 10% by weight)
Lead free electroless nickel plating solution from TOP NICORON SA-98 Excellent in corrosion-, chemical-resistance, bath stability Excellent in anti-discoloration performance (P content: high, 10 to 11% by weight)
High P content, electroless nickel plating solution Excellent in corrosion-, chemical-resistance Excellent in anti-discoloration performance Reduce film stress increase even if MTO proceeds (P content: high, 11 to 12% by weight)
Low to middle type, electroless Ni-P plating solution Can use at a low bath temperature (65 to 75℃) Can maintain deposition speed in continuous use (P content: 4 to 7% by weight)
Low to middle P type, electroless Ni-P plating solution Can use at a low bath temperature (70 to 80℃) Maintain deposition rate regardless of bath aging (P content: 5 to 7% by weight)
Lead-free version from TOP NICORON LPH Low P content High film hardness without heat treatment High wear resistance (P content: low, 1 to 2% by weight)
Low nickel concentration, can reduce chemical cost for initial-make-up Excellent in corrosion resistance, chemical resistance, discoloration resistance (P content: 11% by weight)
Use for Sargent bath, fluoride-free Improve current efficiency and film properties Use TOP HARD CHROME HE-2R (containing chromic acid) for replenishing
Excellent in corrosion-, chemical-resistance The most suitable for parts requiring non-magnetic property For non-magnetic purposes such as plating on resistors (P content: high, 12 to 13% by weight)
Excellent in covering- and anti-discoloration performances, brightness Containing nickel chloride For batch application Lead-free product from TOP NICORON VS-C (P content: middle, 8 to 10% by weight)
Excellent in brightness, anti-discoloration performance Can use for various purposes For batch application Lead-free product from TOP NICORON Q-2 (P content: middle, 7 to 9% by weight)
Can obtain copper plating films with high adhesion power on neodymium magnets Alkaine-type product, not damaging to neodymium magnets Not containing cyanides
Can analyze electroless nickel plating bath Can control nickel concentration and pH automatically Have USB ports to connect with computers Can save data into USB by installed intervals
