OPC COPPER MIC-ST

• Electroless copper plating solution for MID
  Cyanide-free, EDTA-based product for strike plating
  High pattern selectivity, great deposition performance
  Applicable to MID by LDS structure
• Electroless Plating Process Chemical for MID
  
  Electroless Copper Plating Solution
• Printed Wiring Board, Molded interconnect device(MID)