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  • TOP SELENA 73X

    • Can obtain uniform brightness, high levelling power at wide current density areas
      Great ductility, second-processing is possible
      Suitable for underlying nickel plating films for PWB
    • Various Electroplating Chemical

      Nickel Plating
    • General metal, Nonconductor, Printed Wiring Board

  • TOP SELENA DDX

    • Can obtain uniform brightness, levelling performance at wide current density areas
      Great ductility
      Reduce bad effect on film properties by excessive addition
      Easy bath control
    • Various Electroplating Chemical

      Nickel Plating
    • General metal, Nonconductor, Printed Wiring Board

  • TOP PREDIP PW

    • Can conduct direct electroless plating without palladium catalysts
      Use for copper or iron oxide powder
      (Batch treatment)
    • Treatment Chemical for Powder
    • Copper alloy, Iron oxide, Powder

  • TLF-1900(EDCM)

    • Strong cleaning power to shorten treatment time
      Prevent discoloration of copper and brass by alkali
      Prevent excessive dissolution of zinc
      Easily washed off
      Not containing endocrine disrupting chemicals
    • Treatment Chemical for Copper and Its Alloys

      Soak Cleaner
    • Copper alloy, Copper alloy

  • TLF-ETCHBLAST

    • Use as soft-etching agent to copper
      Sulfuric acid-hydrogen peroxide based product
      Can also use by spraying
    • Treatment Chemical for Copper and Its Alloys

      Etching Agent
    • Copper alloy, Copper alloy

  • TLF-6100

    • Use as oxide film stripper to copper and brass lead frames
      Uniformly remove oxide films
      Also have cleaning power, phosphorus based product
    • Treatment Chemical for Copper and Its Alloys

      Oxide Film Remover
    • Copper alloy, Copper alloy

  • TLF-4900

    • Use as chemical polishing agent to copper and brass lead frames
      Shiny appearances come available
      Not generate toxic gases, easy wastewater treatment
    • Treatment Chemical for Copper and Its Alloys

      Chemical Polishing Agent
    • Copper alloy, Copper alloy

  • TLF-3900

    • Use as electro-cleaner for copper, brass lead frames
      Strong cleaning power, no damage substrates
      Chelating-agent free product
      Easy wastewater treatment
    • Treatment Chemical for Copper and Its Alloys

      Electrolytic Cleaner
    • Copper alloy, Copper alloy

  • TLF-1800

    • Use for copper-, brass-lead frames and for hoop plating
      Strong cleaning power, prevent discoloration
    • Treatment Chemical for Copper and Its Alloys

      Soak Cleaner
    • Copper alloy, Copper alloy

  • EPACK KS

    • For ultra high-speed hoop plating to add into acid copper plating bathes
      Can use under high current density
      Can obtain films with high ductility
    • Treatment Chemical for Lead Frames and Hoop Materials

      Ultra-high Speed Acid Copper Plating Brightener for Hoop
    • General metal, Nonconductor

  • PRECIA PN-HS

    • For palladium-nickel alloy plating
      For contact points, PWB terminals, electronic components
      Weak-alkaline-type
      Can use by hoop, rack, barrel plating
    • Various Electroplating Chemical

      Palladium-Nickel Plating
    • General metal, Nonconductor

  • PRECIA PD

    • For electro-palladium plating with whitish tone
      Ammonia-base product
      Maximum thickness: 3μm
      Vickers hardness: approx. Hv400
    • Various Electroplating Chemical

      Palladium Plating
    • General metal, Nonconductor

  • TOP FLOONA

    • Have wide tin concentration range
      Great uniformity, high levelling power
      High solder properties come available
    • Various Electroplating Chemical

      Tin Plating
    • General metal, Nonconductor

  • TURBO LIGHT

    • Use for high-speed continuous nickel plating on brass, steel plates
      Excellent in brightness, levelling power
      Prevent burnt deposition strongly
    • Treatment Chemical for Lead Frames and Hoop Materials

      Ultra-high Speed Nickel Plating Brightener for Hoop
    • General metal, Nonconductor

  • TOP FLEAD SC(for hoop)

    • Sn-Cu alloy plating bath, not containing lead
      Can use as lead free solder plating
      Can obtain stable alloy ratio at wide current density areas
      (Cu content:1 to 2% by weight)
    • Various Electroplating Chemical

      Tin-Copper Allloy Plating
    • Non ferrous metal, Printed Wiring Board

  • TOP FLEAD SC(for barrel plating)

    • Tin-copper alloy plating bath, not containing lead
      Can use as lead free solder plating
      Can obtain stable alloy ratio at wide current density areas
      (Cu content:1 to 2% by weight)
    • Various Electroplating Chemical

      Tin-Copper Allloy Plating
    • Non ferrous metal, Printed Wiring Board

  • TOP FLEAD SC

    • Lead-free, tin-copper films can be obtained
      Can use as the replacement of lead-based solder plating
      Can obtain stable alloy ratio (Cu content: 1 to 2 % by weight) at wide current density areas
    • Various Electroplating Chemical

      Tin-Copper Allloy Plating
    • Non ferrous metal, Printed Wiring Board

  • TOP FLEAD FLX

    • For sulfuric acid based, bright tin-copper alloy plating bath
      Cu content: 1 to 2% by weight
      Also can use for plating on PWB
      Use by rack plating
    • Various Electroplating Chemical

      Tin-Copper Allloy Plating
    • Non ferrous metal, Printed Wiring Board

  • TOP SILVE ACC

    • Immersion-type electroless silver plating solution for copper
      Acidic bath, deposition rate 0.2μm/15min
      No voids between copper and silver
      Can obtain high adhesion silver films
      High bath stability
    • Electroless (Ni-P)/(Pd)/Ag Plating Process

      Electroless Silver Plating Solution
    • Copper alloy, Printed Wiring Board

  • TLF-4000

    • For chemical polishing to steel, alloy 42
      Shiny appearances can be obtained, high-speed polishing
    • Treatment Chemical for Steel and Alloy 42 Materials

      Chemical Polishing Agent
    • Steel, 42Alloy

  • TLF-1300M

    • For steel, alloy 42, lead frames, hoop substrates and general cleaning
      Alkaline-type product
      Containing phosphorus, not make silicate films
      Low COD product
    • Treatment Chemical for Steel and Alloy 42 Materials

      Soak Cleaner
    • Steel, 42Alloy

  • TLF-1300

    • For cleaning to iron substrates
      Silicate-free product, alkaline-type cleaner
    • Treatment Chemical for Steel and Alloy 42 Materials

      Soak Cleaner
    • Steel, 42Alloy

  • TOP CHEM ALLOY 66-LF

    • Lead-free product
      High deposition performance
      High film hardness is available without heat treatment
      The most suitable for electronic components and ceramics
      Can use continuously by replenishing
      (B content: 0.2 to 0.6% by weight)
    • Electroless Nickel Plating Chemical
    • General metal, Ceramics

  • ICP NICORON LTN(NP)

    • Lead-free electroless nickel-phosphorus plating solution
      Excellent in fine pattern forming performance
      High solder wettability and solder joint strength
      Can use at 65℃, best for MID
      P content: 5% by weight
    • Electroless Plating Process Chemical for MID

      Electroless Nickel Plating Solution
    • Printed Wiring Board, Molded interconnect device(MID)

  • OPC CLEANER MIC

    • Weak alkaline cleaner for LDS structure
      Strongly remove residues by laser processing
      Improve deposition performance of strike copper plating
    • Electroless Plating Process Chemical for MID

      Alkaline Cleaner
    • Printed Wiring Board, Molded interconnect device(MID)

  • OPC COPPER MIC-ST

    • Electroless copper plating solution for MID
      Cyanide-free, EDTA-based product for strike plating
      High pattern selectivity, great deposition performance
      Applicable to MID by LDS structure
    • Electroless Plating Process Chemical for MID

      Alkaline Cleaner
    • Printed Wiring Board, Molded interconnect device(MID)

  • OPC COPPER MIC-BL

    • Electroless copper plating solution for MID
      Cyanide-free, EDTA-based product
      High bath stability, high speed plating is possible (5μm/h)
      High selectivity to copper
    • Electroless Plating Process Chemical for MID

      Electroless Copper Plating Solution
    • Printed Wiring Board, Molded interconnect device(MID)

  • TOP TEENA LMP-BiSb

    • Can obtain semi-bright bismuth-antimony alloy plating films
      (Sb content: 5 to 10 mass%)
      Higher film hardness and sliding performance than bismuth plating films
    • Bismuth-Antimony Alloy Plating
    • General metal

  • TLF-5200

    • To remove rust from steel and smut
      Best for pretreatment before TLF-4000
    • Treatment Chemical for Steel and Alloy 42 Materials

      Rust Remover
    • Steel

  • TLF-4300

    • For chemical polishing to steel
      Can obtain shiny appearances quickly
      Can use to remove metal burr
    • Treatment Chemical for Steel and Alloy 42 Materials

      Chemical Polishing Agent
    • Steel

  • OPC BLACK SOUL

    • Not increase electric resistance
      Improve solder wettability
      Prevent discoloration of blackened films
    • Blackening Treatment Process Having High Smoothness for Copper Substrates
    • Printed Wiring Board

  • TOP SILVE PD

    • Pure palladium films come available
      For fine pattern formation
    • Electroless (Ni-P)/(Pd)/Ag Plating Process

      Electroless Palladium Plating Solution
    • Printed Wiring Board

  • TOP SILVE AG

    • Reducing-type electroless silver plating solution
      High bath stability
      Cyanide-free product
    • Electroless (Ni-P)/(Pd)/Ag Plating Process

      Electroless Silver Plating Solution
    • Printed Wiring Board

  • OPC BLACK KEEP

    • Use to prevent discoloration for blackened copper substrates
      Not change film reflectivity and elecric resistance
    • Blackening Treatment Process Having High Smoothness for Copper Substrates

      Tarnish Preventing Agent
    • Printed Wiring Board

  • OPC BLACK COPPER

    • Can obtain uniform and smooth black color films
      Not increase film resistance
      Can treat quickly
    • Blackening Treatment Process Having High Smoothness for Copper Substrates

      Blackening Treatment Agent
    • Printed Wiring Board

  • OPC COPPER NCA

    • Have high deposition performance (5 to 6μm/h)
      Great deposition selectivity
      Cyanide-free, EDTA based product
      Stabilizer can be analyzed
    • Electroless Copper Plating Solution
    • Printed Wiring Board

  • OPC COPPER HFS

    • Low internal stress, strong folding endurance, suitable for FPC boards
      Cyanide-free, rochelle salt based product
      Have great deposition selectivity
    • Electroless Copper Plating Solution
    • Printed Wiring Board

  • OPC COPPER AF-F

    • Cyanide-, formaldehyde-free, weak-alkaline product
      Excellent in pattern selectivity performance
      Excellent in initial deposition performance to low surface roughness substrates
      Prevent blisters on low surface roughness substrates
    • Electroless Copper Plating Solution
    • Printed Wiring Board

  • OIC POST DIP

    • Remove palladium residues between fine patterns
    • Post-dipping Agent
    • Printed Wiring Board

  • OIC CLEANER

    • EXcellent in permeability, weak-acid type cleaner
    • Alkaline Cleaner
    • Printed Wiring Board

  • OIC COPPER

    • Very strong deposition selectivity
      Cyanide-free, EDTA based product
    • Electroless Copper Plating Solution
    • Printed Wiring Board

  • OIC ACCERA

    • Strongly activate silver, neutral type product
    • Activator
    • Printed Wiring Board

  • ARG COPPER

    • Cyanide-free, EDTA based product
      Excellent deposition performance on silver
      Can omit palladium activating step
      Also applicable to continuous conveyance system
    • Electroless Copper Plating Solution
    • Silver Paste