History (Metal Finishing)

1949

Started manufacturing and sales of buffing compounds

1958

Started manufacturing and sales of nickel plating brighteners

1963

Started manufacturing and sales of chemicals for plating on plastic

1966

Started manufacturing and sales of liquid buffing compounds, chemicals for aluminum

1970

Started manufacturing and sales of cyanide-free zinc plating brighteners

1978

Started manufacturing and sales of electroless nickel plating products

1980

Started joint development with Hodogaya Chemical Co., Ltd. for TAC DYESTUFF, focusing on dye developments to color anodized aluminum substrates

1982

Started manufacturing and sales of pre-treatment products for PWBs
Started manufacturing and sales of acid copper plating additives for through-hole plating

1983

Started manufacturing and sales of chemicals for high corrosion resistance plating

1985

Started manufacturing and sales of anodizing process products for aluminum die-casting parts

1986

Built R & D center for metal finishing department

1989

Developed the technology to extend bath life of electroless nickel plating solutions

1992

Started manufacturing and sales of plating chemicals for isolated circuit boards
Started manufacturing and sales of chemicals for electroless precious-metal plating
Started manufacturing and sales of pre-treatment chemicals for build-up PWBs

1994

Built business center for metal finishing department

1995

Started manufacturing and sales of chemicals for direct electro-copper plating for PWBs

1996

Developed automatic bath control system for electroless nickel plating solutions

1998

Started manufacturing and sales of chemicals for eco-friendly plating process to plate on plastic, lead-free electroless nickel plating solutions

2000

Started manufacturing and sales of plating chemicals for tin-copper alloy to realize lead-free requirements

2001

Started manufacturing and sales of plating chemicals for via-filling and for trivalent chromium conversion

2002

Started manufacturing and sales of chemicals for electroless copper plating for the next generation

2003

Started manufacturing and sales of chemicals for neutral electroless nickel/gold plating process

2005

Started manufacturing and sales of plating chemicals for via-filling, chemicals to form fine patterns

2006

Started manufacturing and sales of PFOS-, lead-free composite electroless plating solutions, electroless plating chemicals for FPCs

2008

Started manufacturing and sales of process chemicals for electroless nickel/palladium/gold plating

2009

Started manufacturing and sales of acid copper plating additives for via-filling for the next generation, all-wet plating process chemicals for polyimide films, chemicals for electroless palladium/gold plating

2010

Started manufacturing and sales of chemicals for trivalent chromium plating, electroless copper plating process for isolated circuit boards

2011

Started manufacturing and sales of chemicals for zinc-nickel alloy plating, chemical conversion, formaldehyde-free electroless copper plating solutions, and process chemicals to form lamination structures for LED lights

2012

Started manufacturing and sales of electroplating for black colors

2013

Started manufacturing and sales of process chemicals for chromium-free etching for plating on plastic

2014

Started manufacturing and sales of chemicals for plating on plastic to realize high corrosion resistance

2016

Established Advanced Technology Research Center

2017

Started manufacturing and sales of chromium-, palladium-free etching process products for plastic that can shorten treatment steps significantly

2019

Started manufacturing and sales of electroless copper plating process that can increase the reliability of semiconductor packages (OPC FLET PROCESS)

2023

As a new brand of surface treatment products for semiconductor back-end processes, released "TORYZA EL PROCESS" series and "TORYZA LCN" series

Back