Acid copper plating additive for PWBs to realize high throwing power
TOP LUCINA MSD
To realize device miniaturization as well as to achieve advanced performance and high-density surface mounting, various designs of PWB (Printed wiring board) have been strongly demanded.
In through-hole copper electroplating (conformal copper plating) for PWBs, we have recently needed the acid copper plating additives that can provide excellent throwing power into micro-through holes at high aspect ratios. Considering the productivity improvement in plating processes, bath stability and easy bath maintenance is also required for these additives.
To satisfy these requirements at the same time, we have developed a new acid copper plating additive that can increase the freedom of PWB designs and the product efficiency in plating processes.
Product features, specifications
TOP LUCINA MSD is the additive for electrolytic copper through-hole plating (conformal copper plating). TOP LUCINA MSD can realize high throwing power at a wide variety of current density, and can use for PWBs with high aspect ratios. Also, this product is excellent in bath stability, so the performance of acid copper plating bath can be continuously maintained for a long time. Furthermore, bath maintenance time can be reduced as black films will be produced on copper anodes stably in the bath using TOP LUCINA MSD.
We have a lot of plating additives and surface-finish chemicals from pre-treatment to post-treatment regarding PCBs, so please feel free to contact us from our web inquiry form.
Acid copper plating additive for PWBs to realize high throwing power
TOP LUCINA MSD can realize high throwing power at a wide variety of current density, and can use for PWBs with high aspect ratios. Also, this product is excellent in bath stability, so the performance of acid copper plating bath can be continuously maintained for a long time.