Acid copper plating additive for through hole plating, applicable to BVH
TOP LUCINA HLS
In recent years, printed circuit boards used in motherboards and automotive boards have become denser and more multilayer. In these areas, through-hole diameters are becoming smaller, so the demand for higher aspect ratio and improved throwing power is a hot topic.
In response to the trend toward higher density and multilayer printed circuit boards, we have developed a new additive for copper electroplating that allows free wiring design and high productivity in the plating process.
Product features, specifications
TOP LUCINA HLS is an additive for acid copper plating for through-hole applications, which can also be used for BVH.
When conventional additives for through-hole plating are used for highly multilayered PWBs, it may cause a thin film thickness in through-holes, which can cause cracks in the circuits depending on the operating environment.
This product exhibits excellent throwing power and is not susceptible to deterioration by bath temperature, thus enhancing productivity and reliability of connections.
We provide a comprehensive products in plating for printed wiring boards, and we invite inquiries for further information.
Acid copper plating additive for through hole plating, applicable to BVH
This product exhibits excellent throwing power and is not susceptible to deterioration by bath temperature, thus enhancing productivity and reliability of connections.