Most of raw materials for electronics components are made of alumina or soda-lime glass. As fuel-cell and hybrid-car market grows, the demands for electronics components and power devices are sharply rising. As a result, highly efficient heat-dissipating materials (like aluminum nitride) as well as low-expansion materials with high heat-cycle durability (like quartz) attract attention to fabricate low-expansion substrates. Generally, glass frits for overcoat indicates high coefficient of thermal expansion, so they can’t be used for such low-expansion purposes. To solve the problem, we have developed new products to deposit a crystal glass with negative thermal-expansion coefficient using Li2O-Al2O3-SiO2 (LAS).