2024.12.24표면처리전시회정보

"제26회 반도체･센서 패키징전 반도체 후공정 전문전 (ISP) " 출전 안내

2025년 1월 22일(수)~24일(금)에 TOKYO BIG SIGHT서 개최되는 "제26회 반도체・센서 패키징전 반도체 후공정 전문전(ISP) "에 출전합니다. 사원 일동 모두 여러분의 방문을 진심으로 기다리고 있겠습니다.

일시

2025년 1월 22일(수)~24일(금)

개최 장소

Tokyo Big Sight, East 7 Hall, E63-62

내용

Plating technology for semiconductor wafer

• UBM formation for Al electrode on wafer
• Electroless plating equipment for wafer to make UBM
• Acid copper plating additive to silicon interposer for high aspect ratio filling
• Acid copper plating additive to copper pillar formation
• Acid copper plating additive to low aspect via filling for high current, high heat radiation
• Acid copper plating additive for ultra-fine pattern formation

Plating technology for IC substrates

• Electroless copper plating process to solve Weak-Micro Via for high connection reliability
• Acid copper plating additive for high-current density, fine pattern via filling
• Acid copper plating additive for large diameter vias

The latest surface finishing process

• Electroless plating process for power modules
• High joint reliability electroless nickel/gold plating process for fine pattern formation, high joint reliability
• Electroless nickel-boron plating process on metal ink pastes of sintered substrates
• Highly-reliable granular copper plating technology with high adhesion to molding materials
• Acid copper plating additive for through-hole filling to glass substrates
• Highly adhesive plating process on glass

Surface finishing for environmentally friendly

• Electroless nickel plating solution from recycled nickel materials

URL

https://blog.naver.com/reed_japan/223336855920