2024.09.12표면처리전시회정보

"SEMICON TAIWAN" 에 출전했습니다.

2024년9월4일(수)~6일(금)까지 개최된 "SEMICON TAIWAN" 에서당사부스를 방문해주셔서 대단히 감사합니다.
자세한 사항은 홈페이지를 통해서문의 부탁드립니다.

내용

Surface finishing and plating technology for semiconductor wafers

• UBM formation on aluminum electrodes on wafers, “TORYZA EL PROCESS”
• Acid copper plating additive for silicon interposers, for high-aspect ratio filling
  “TORYZA LCN SV”
• Acid copper plating additive for micro-bump and trench filling
  “TORYZA LCN SD”
• Acid copper plating additive for FO-PLP/WLP, copper pillar formation under high current density
  “TORYZA LCN SP”
• Acid copper plating additive for ultra-micro patterning
  “TORYZA LCN FRV”

The latest surface finishing for package and IC substrates

• Electroless copper plating process with high connection reliability to solve Weak-Micro Via
  “OPC FLET PROCESS”
• Acid copper plating additive for via-filling under high current density
  “TOP LUCINA NSV ADV”
• Acid copper plating additive for large-diameter via
  “TOP LUCINA NSV LV”