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Metal Finishing Department
Acid Copper Plating Additive for Via-filling applicable to Fine Pattern
[Top Lucina NSV]
The conventional plating bath for via-filling is based on the acid copper plating bath which contains high concentration of copper sulfate and low concentration of sulfuric acid, and has subject to the throwing power.
Especially, in case of pattern plating applied in mainly semi-additive method, uneven film thickness occurs by the size or density of pattern. The newly developed "Top Lucina NSV" can be applied to via-filing plating at the plating bath having low concentration of copper sulfate and higher concentration of sulfuric acid, which is similar to high-throwing power bath, and gains excellent throwing power. Therefore, "Top Lucina NSV" is suitable for via-filling plating on packaging board having fine pattern.
Electroless Ni-P Plating having Excellent Bending Resistance (For Isolated Circuit Board)
[ICP Nicoron FPF]
Recently, in accordance with the trend of minimization or lightening weight of mobile phone and electronics components, the demands to flexible board (FPC board) has been enhancing remarkably. Though electroless Ni-P/Au plating has been applying widely as the final surface treatment of the manufacturing process of FPC board, in case of application of bending at assembling step or others, crack forms on not only Ni-P plating part, but also copper circuit part owing to big difference of the ductility of Cu and Ni-P, and disconnection of wire may occur.
Okuno Chemical Industries Co., Ltd. developed new plating bath "ICP Nicoron FPF" which gives Ni-P plating film having excellent ductility
Plastic Plating Process by Per-manganate Etching Process
The plating technology on ABS resin which has been applying most widely in plating on plastics was already established, and industrialized by many job shops for plating. For the plastic plating process which has been applying practically today, the etching step composed of chromic acid and sulfuric acid is essential. By this etching treatment by chromic acid, butadiene on the ABS resin surface is oxidized and dissolved, and many fine pores form on the resin surface, and consequently, we can gain high adhesion of plating film. (anchor effect)
However, the hexa-valent chromium contained in this chromic acid etching solution is carcinogen and harmful to human body. And also, the hexa-valent chromium induces poor work environment and serious environmental pollution subject to waste solution and discharged water and has severe discharged water regulation standard. So there are many subject in its waste water treatment such as need high cost and others.
As the substitution material of chromic acid etching, we can introduce per-manganate salt. However, the conventional acidic per-manganate solution has poor stability, and it is rather hard for us to use this bath continuously. We developed plastic plating process "CRO-MARS Process" which uses etching treatment by acidic per-manganate solution having excellent bath stability.
Light Fastness Improvement Method of Aluminum Anodizing and Dyeing Treatment
Anodizing and dyeing treatment of aluminum alloys has been applying widely to various applications such as mobile phone, digital camera and others, as it can give colorful tone without spoiling its metallic appearance. However, as water soluble organic dyes are applied to dyeing, the color tone will be faded-out by irradiation of light such as ultra-violet ray. As the improvement method of light fastness of dyed aluminum film, we checked the effectiveness of usage of photo-stabilizer or ultra-violet ray absorption agent to aluminum anodized and dyed articles. Under our investigation, we found that the application of hindered amine type photo stabilizer on the dyed article by metallic complex azo dyes among various dyes was extremely effective.