Improve covering performance into through and via holes Excellent in penetration power into small holes Suitable for horizontal conveyance plating system (Batch treatment is possible)
Reduce time for roller maintenance from acid-type catalyst process Excellent permeability into small holes Can shorten treatment time Strong adsorbing power of catalysts to PWBs Reduce Pd concentration at the time of initial make-up to 50%
Promote catalyst adsorption on hole wall, resin, glass fiber Can omit anionic pre-dipping step High connection reliability with inner copper foils Prevent foaming by agitation or bath circulation
Use for electroless copper plating by horizontal conveyance system Cyanide-free, rochelle salt based product Can show high deposition performance quickly High bath stability, not cause bristers on low surface roughness substrates
