TORYZA PD AA

• A dense, heat-resistant palladium film can be obtained without affecting the underlying nickel
  Gold plating on palladium provides excellent solderability and gold wire bonding
  Can be used continuously for up to 2 MTO
  Neutral bath, little damage to the base material, cyanide compound free
• Electroless Ni/(Pd)/Au Plating Process
  
  Electroless Palladium Plating Solution
• Wafer