OPC FLET PROCESS

• The OPC FLET process is an electroless copper plating process that is compatible with semi-additive methods. It has excellent uniform deposition on the material surface and inside via holes, reduces circuit width narrowing during flash etching, and also suppresses precipitation on copper, achieving crystal continuity between inner layer copper and upper layer plating copper. This process is ideal for forming fine patterns and micro via holes on IC substrates, suppressing the generation of voids.
• Process for Buildup Printed Wiring Boards
• Printed Wiring Board

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  「OPC FLET PROCESS」
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