ICP NICORON LPW-LFN

• Not containing sulfur and lead compounds
  (Apart from sulfuric acid and sulfate ions)
  P content 3 to 4％ by weight, film density 8.5/cm3
  Excellent in fine pattern formation performance
  Not make passivate films easily
  Prevent solder wettability decrease by oxidation
  Reduce solder diffusion into nickel
• Electroless Ni-P/Au Plating Process
  
  Electroless Nickel Plating Solution
• Printed Wiring Board