ICP NICORON GM-EC

• Deposition rate: 12μm/h P content: 7~11wt
  Blackening and corrosion are unlikely to occur after Au plating is peeled off
  Fine pattern formation performance
  Excellent in solder wettability and solder joint strength
• Electroless Ni-P/Au Plating Process
  
  Electroless Nickel Plating Solution
• Printed Wiring Board