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OPC FLET COPPER

  • High connecting reliability with inner copper foil and plated copper
    Can obtain copper film with small thickness stably
    Great deposition performance into via-, through-holes
    High adhesion power on low Ra materials, prevent blisters
    High purity copper is available
    Low sheet resistance is possible even by small thickness
  • Electroless Copper Plating Solution
  • Printed Wiring Board