Search
product

FLASH GOLD 330

  • Reduce damage to nickel films
    Fine and uniform film appearance can be obtained
    High solder wettability and solder joint strength
    Can use at a low temperature (0.06μm/10min at 80℃)
  • Electroless Ni-P/Au Plating Process

    Electroless Gold Plating Solution
  • Printed Wiring Board