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NPG FLASH GOLD SR

  • High solder wettability, solder joint strength and gold wire bonding performance
    Best product for electroless Ni-P/Pd/Au process
    Stable deposition performance, can obtain uniform deposits on palladium films
    High deposition performance (0.1μm/25min, on 0.1μm of palladium film)
    Prevent base film corrosion
  • Electroless Ni-P/Pd/Au Plating Process

    Electroless Gold Plating Solution
  • Printed Wiring Board