Featured
Copper electroplating additives for semiconductor wafers
TORYZA LCN series
Plating technology is used in the manufacture of semiconductor devices, the interposers on which the semiconductor devices are mounted, and the printed circuit boards. In these components, plating plays an important role in the transmission of electrical signals, power supplies, and heat radiation.
As semiconductors evolve in functionality, performance, and miniaturization, new packaging technologies for 3D integration are being developed. Additionally, it is also increasingly important to respond to the miniaturization of the wiring, the fine line spacing, and the high heat dissipation.
We are introducing new additives, called TORYZA LCN series, for copper electroplating. These additives are specifically designed for use in semiconductor devices and interposers.
Product features, specifications
OKUNO launches the new additives, called TORYZA LCN series, for copper electroplating.
・Acid copper plating additive for ultra fine patterns, FOWLP/FOPLP, and advanced packages
・Acid copper plating additive for copper pillar formation on semiconductor wafers and IC substrates
・Acid copper plating additive for silicon interposers
・Acid copper plating additive for high heat radiation, high current density
Copper electroplating additives for semiconductor wafers
We are introducing new additives, called TORYZA LCN series, for copper electroplating. These additives are specifically designed for use in semiconductor devices and interposers.