2022.07.04Metal FinishingNews
PLOPX, an electroless copper plating process for glass substrates, won the 18th JPCA Award.
Glass is the candidate as an interposer for 2.5D IC because it is excellent in surface smoothness as well as insulation and signal transmission properties. In collaboration with Panasonic Environmental Systems & Engineering Co., Ltd., we have developed PLOPX, an electroless copper plating process for glass substrates that utilizes the metal oxide layers from liquid phase deposition method to ensure high adhesion.
PLOPX has an advantage that the process is consist of wet method so that it can achieve mass production and high production efficiency. PLOPX, an electroless copper plating process for glass substrates, can be put in use in high-speed 5G and 6G communication systems. For detailed and the latest technical information, please contact us from web inquiry form.