2024.12.24Metal Finishing Exhibitions

We will exhibit at IC & SENSOR PACKAGING TECHNOLOGY EXPO in NEPCON JAPAN.

We will exhibit at IC & SENSOR PACKAGING TECHNOLOGY EXPO in NEPCON JAPAN in Tokyo from January 22 (Wed.) to January 24 (Fri.).
We will introduce OKUNO’s plating & surface finishing technology for semiconductors, IC substrates, PCB and FPCs.

Please check the details and receive VISITOR BATCH from Visitor resistration page of NEPCON JAPAN.
We are looking forward to seeing you soon.

Date

January 22 (Wed.) to January 24 (Fri.), 2025

Place

Tokyo Big Sight, East 7 Hall, E63-62

Content

Plating technology for semiconductor wafer

UBM formation for Al electrode on wafer
Electroless plating equipment for wafer to make UBM
Acid copper plating additive to silicon interposer for high aspect ratio filling
Acid copper plating additive to copper pillar formation
Acid copper plating additive to low aspect via filling for high current, high heat radiation
Acid copper plating additive for ultra-fine pattern formation

Plating technology for IC substrates

Electroless copper plating process to solve Weak-Micro Via for high connection reliability
Acid copper plating additive for high-current density, fine pattern via filling
Acid copper plating additive for large diameter vias

The latest surface finishing process

Electroless plating process for power modules
High joint reliability electroless nickel/gold plating process for fine pattern formation, high joint reliability
Electroless nickel-boron plating process on metal ink pastes of sintered substrates
Highly-reliable granular copper plating technology with high adhesion to molding materials
Acid copper plating additive for through-hole filling to glass substrates
Highly adhesive plating process on glass

Surface finishing for environmentally friendly

Electroless nickel plating solution from recycled nickel materials

URL

https://www.nepconjapan.jp/tokyo/en-gb.html#/

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