2024.11.12Metal FinishingExhibitions

We will exhibit at SEMICON Japan 2024.

We will exhibit at SEMICON Japan 2024 in Tokyo, Japan from December 11 (Wednesday) to December 13 (Friday).
We will introduce OKUNO’s plating & surface finishing technology for semiconductors and IC substrates in The Advanced Packaging and Chiplet Summit (APCS) area.
Please check the details and receive VISITOR BATCH from SEMICON Japan 2024 Official Website.
We are looking forward to seeing you soon.

Date

December 11 (Wednesday) to December 13(Friday), 2024

Place

TOKYO BIG SIGHT, East Exhibition Hall 3 in The Advanced Packaging and Chiplet Summit (APCS)

Content

Plating technology for semiconductor wafer

• UBM formation on aluminum electrode on wafer
• Electroless plating equipment for wafer to make UBM
• Acid copper plating additive for wafer

Acid copper plating additive for hybrid Cu-Cu bonding

Acid copper plating additive for through-hole filling to glass substrates

Crack inhibitor for aluminum hard anodizing

URL

https://www.semiconjapan.org/en/