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2024.10.28Metal FinishingExhibitions

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Content

Plating technology for semiconductor wafers

  • Plating additive for copper electroplating
    -TSV filling
    -Copper pillar formation
    -High via-filling performance, high thickness uniformity
    -Low-aspect via-filling, trench-filling
  • Electroless copper plating process on glass substrate with high adhesion
  • UBM formation process on aluminum electrodes on semiconductor wafers

The latest surface finish for IC substrates

  • Electroless copper plating process for high reliability
  • Copper electroplating additive for high thickness uniformity (for via-filling)
  • Palladium residur remover to form ultra-micro patterns
  • Electroless Ni/Au plating process to realize small thickness utilizing reduced-type cobalt catalysts

The latest surface finish and plating technology for PCB

  • Additive for copper electroplating (for large-diameter via filling)

The latest surface finish and plating technology for FPC

  • Electroless plating process for LCP, realize high-frequency and high speed telecommunication
  • Additive for electroplating for horizontal Roll to Roll plating system
  • Electroless Ni/Au plating process for ultra-micro patterning

Plating process for power modules

  • Electroplating process for dielectric substrates

Glass powder, pastes and materials for electronic components

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