2024.10.09Metal FinishingExhibitions

We will exhibit at TPCA Show -TAIPEI-.

We will exhibit at TPCA Show -TAIPEI- in Taiwan from October 23 (Wed.) to 25 (Fri.), 2024.
We will introduce the latest surface finishing and plating technology about semiconductor wafers, IC substrates, PCB, FPC and power modules. Admission is free by on-sight registration, so please come and visit us to know the latest technology.
Please check the details fromt the official website of TPCA Show -TAIPEI-. We are looking forward to seeing you soon.

Date

2024.10.23 Wed. to 25 Fri., 10:00-17:00 (Closing one hour early on the last day)

Place

https://www.tainex.com.tw/en/
Booth No. K-1315

Content

Plating technology for semiconductor wafers

• Plating additive for copper electroplating
  -TSV filling
  -Copper pillar formation
  -High via-filling performance, high thickness uniformity
  -Low-aspect via-filling, trench-filling
• Electroless copper plating process on glass substrate with high adhesion
• UBM formation process on aluminum electrodes on semiconductor wafers

The latest surface finish for IC substrates

• Electroless copper plating process for high reliability
• Copper electroplating additive for high thickness uniformity (for via-filling)
• Palladium residur remover to form ultra-micro patterns
• Electroless Ni/Au plating process to realize small thickness utilizing reduced-type cobalt catalysts

The latest surface finish and plating technology for PCB

• Additive for copper electroplating (for large-diameter via filling)

The latest surface finish and plating technology for FPC

• Electroless plating process for LCP, realize high-frequency and high speed telecommunication
• Additive for electroplating for horizontal Roll to Roll plating system
• Electroless Ni/Au plating process for ultra-micro patterning

Plating process for power modules

• Electroplating process for dielectric substrates

Glass powder, pastes and materials for electronic components

URL

https://tw.tpcashow.com/en/