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2024.09.12Metal FinishingExhibitions

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Content

Surface finishing and plating technology for semiconductor wafers

  • UBM formation on aluminum electrodes on wafers, “TORYZA EL PROCESS”
  • Acid copper plating additive for silicon interposers, for high-aspect ratio filling
    “TORYZA LCN SV”
  • Acid copper plating additive for micro-bump and trench filling
    “TORYZA LCN SD”
  • Acid copper plating additive for FO-PLP/WLP, copper pillar formation under high current density
    “TORYZA LCN SP”
  • Acid copper plating additive for ultra-micro patterning
    “TORYZA LCN FRV”

The latest surface finishing for package and IC substrates

  • Electroless copper plating process with high connection reliability to solve Weak-Micro Via
    “OPC FLET PROCESS”
  • Acid copper plating additive for via-filling under high current density
    “TOP LUCINA NSV ADV”
  • Acid copper plating additive for large-diameter via
    “TOP LUCINA NSV LV”

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