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Presentations in seminar, exhibition

    2019

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    The Latest Technology About Plating On Plastic By Okuno Shingo Nishiki
    2019/4/10 Super Molder Association, Seminar in April Plastic News Polyplastics Co., Ltd
    Effects of Electroless Copper Plating on Crystal Continuity in Via Bottom Yuhei Kitahara
    2019/4/18 ICEP 2019 The Japan Institute of Electronics Packaging TOKI MESSE NIIGATA CONVENTION CENTER
    Development of Electroless Ni-P Plating Film for Power Modules Norihiko Hasegawa
    2019/4/18 ICEP 2019 The Japan Institute of Electronics Packaging TOKI MESSE NIIGATA CONVENTION CENTER
    Coloring of Anodized Aluminum Films (basic) Kenji Hara
    2019/5/10 102th ARS Seminar The Surface Finishing Society of Japan
    Anodizing Research Society
    Osaka Research Institute of Industrial Science and Technology(Morinomiya Center)
    Next generation plating on plastics process without hexavalent chromium and palladium Shingo Nagamine
    2019/5/15 25th ISE Topical Meeting International Society of Electrochemistry University of Castilla-La Mancha, Spain
    Dyeing and light-resistance hechnology about anodized aluminum films Kenji Hara
    2019/5/23 324th Seminar The Surface Finishing Society of Japan
    Light Metal Surface Treatment Technology Association
    HORIBA Group Premium Hall
    Development of Electroless Ni-P Plating Film for Power Modules Kei Hashizume
    2019/5/31 125th Micro Joining Research Committee Japan Welding Society Tokyo Branch of the Osaka University Graduate School of Medicine / Engineering
    High Corrosion Resistance Treatment for Anodized and Dyed Film on Aluminum Takamitsu Tsujimoto
    2019/6/3 3rd International Symposium on AST2019 Anodizing Research Society of The Surface Finishing Society of Japan Awaji Yumebutai International Conference Center
    Effect on Solder Jointing by Nickel-free Final Surface Treatment Process Kei Hashizume
    2019/6/6 Micro Soldering Technology Seminar (Trends about in Microsoldering Technology) Japan Electronics Packaging and Circuits Association,
    The Japan Welding Engineering Society
    TOKYO BIG SITE
    Electroless Ni-P Plating Solution with High Resisssstance Against Cracks "TOP UBP NICORON HR" Jun-ichi Nakazato
    2019/6/6 JPCA Show 2109 NPI Presentation Japan Electronics Packaging and Circuits Association TOKYO BIG SITE
    Additives for Acid Copper Plating Applicable to Pattern-, Via-filling Plating,, "TOP LUCINA GAP" Ryo Tanaka
    2019/6/7 JPCA Show 2109 NPI Presentation Japan Electronics Packaging and Circuits Association TOKYO BIG SITE
    Composite Plating Technology Using Electroless Copper Plating Tashimtsu Nagao
    2019/6/25 Meeting in June The Surface Finishing Society of Japan, Plating Section HORIBA Group Premium Hall
    Films for Zn-Ni-SiO2 composite plating from acidic bath Masafumi Nozaki
    2019/6/25 Meeting in June The Surface Finishing Society of Japan, Plating Section HORIBA Group Premium Hall
    Aluminum Surface Roughtening Process For Resin Bonding Ayumi Hongo
    2019/6/28 2019 Academic / Technical Presentation Conference Aluminum Finishing Society of Kinki HOTEL AWINA OSAKA
    Electroplating basics Shingo Nishiki
    2019/7/25 Summer Training Seminar (I) The Surface Finishing Society of Japan Tokyo University of Science (Noda campus)
    Technology Trends in Anodized and Dyes Aluminum Kenji Hara
    2019/7/26 Kanagawa Prefecture Plating Association, Youth Seminar Kanagawa Prefecture Plating Association Kanagawa Industrial Promotion Center
    Alternative technology as the replacement of Ti-Cd plating by Zn-Ni-SiO2<\sub> composite plating from acidic bath Masafumi Nozaki
    2019/9/9 140th Lecture The Surface Finishing Society of Japan Fukuoka Institute of Technology
    Crystalline hard trivalent chromium plating showing high current efficiency Yusuke Yoshikane
    2019/9/10 140th Lecture The Surface Finishing Society of Japan Fukuoka Institute of Technology
    Via-hole filling additive for acid copper electroplating baths to achieve high thickness uniformity Ryo Tanaka
    2019/9/12 MES2019 The Japan Institute of Electronics Packaging Osaka University
    Developments of High Reliability Process and Evaluation Method for Ultra-fine Cu Wiring for 2.1D Packaging Taka Kanayama
    2019/9/13 MES2019 The Japan Institute of Electronics Packaging Osaka University
    Development of Electroless Ni-P/Au Plating Process Corresponding to Roll to Roll Plating System Eri Takatsuji
    2019/9/12 MES2019 The Japan Institute of Electronics Packaging Osaka University
    Electroless Nickel Plating (Basic and Advanced) Kei Hashizume
    2019/9/26 Kansai Seminar The Surface Finishing Society of Japan(Kansai) Osaka Research Institute of Industrial Science and Technology (Morinomiya Center)
    Plastic On Plating (Basic and Advanced) Junji Yoshikawa
    2019/9/26 Kansai Seminar The Surface Finishing Society of Japan(Kansai) Osaka Research Institute of Industrial Science and Technology (Morinomiya Center)
    Electroless Ni/Pd/Au process for microelectrodes Yuki Tsuno
    2019/10/4 The 71th seminar The Japan Institute of Metal and Materials, Nano-plating research association Ota City Industrial Plaza (PiO)
    WHY? about Chemicals For Plating Shingo Nishiki
    2019/10/10 Why? series (14th Seminar) Japan Surface Finishing Suppliers Association L Osaka (Osaka Prefectural Labor Center)
    Plating Process For ABS Resin Using Etchant Not Containing Hexavalent Chromium Shingo Nagamine
    2019/10/23 Meeting in October, 2019 Electroplating Society OSAKA MEKKI KAIKAN
    New Electroless Copper Plating Process Showing Crystal Continuity Yuki Kuribayashi
    2019/10/24 Shuzenji Workshop The Japan Institute of Electronics Packaging Laforet Shuzenji
    New product news about electroless nickel plating solutions Kei Hashizume
    2019/10/30 TOSHUKAI, Meeting in October Kyoto Elector Plating Association Kyoto Prefectural Technology Center for Small and Medium Enterprises
    Coloring technology to anodized aluminum Kenji Hara
    2019/11/11 The 38th Seminar of Future Plating Technology The Surface Finishing Society of Japan Kairo Kaikan

    2018

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Effect on film properties by phosphorus and sulfur content in electroless Ni-P plating films Norihiko Hasegawa
    2018/4/19 ICEP-IAAC 2018 The Japan Institute of Electronics Packaging Hotel Hanamizuki (Kuwana, Mie)
    Ultra-fine patterning technology by utilizing nano-silver catalysts in MSAP Yuhei Kitahara
    2018/4/19 ICEP-IAAC 2018 The Japan Institute of Electronics Packaging Hotel Hanamizuki (Kuwana, Mie)
    OPC FLET PROCESS, Electroless Copper Plating Process with High Connecting Reliability Yuhei Kitahara
    2018/6/7 JPCA Show 2018 NPI Presentation Japan Electronics Packaging and Circuits Association TOKYO BIG SITE
    Coloring for Anodized Aluminum Substrates (Basic) Kenji Hara
    2018/6/15 2018 Tutorial: Anode Oxidation (Basic) in 99th Lecture The Surface Finishing Society of Japan
    Anodizing Research Society
    Tokyo Metropolitan University, Akihabara campus
    Next-Generation Process to Metalize Plastic for Lightweight Application Shota Akimono
    2018/6/22 Surface & Coatings Forum 2018 TEPNET, MMRI, MTEC, STI, TCMA, Reed Tradex Bangkok International Trade & Exhibition Center (BITEC)
    Treatment to Improve Light Resistance of Anodized Dyeing Ayumi Hongo
    2018/6/29 2018 Academic / Technical Presentation Conference Aluminum Finishing Society of Kinki HOTEL AWINA OSAKA
    Sealing Treatment for Anodized and Dyed Aluminum Substrates Kenji Hara
    2018/7/12 38th Summer Seminar Light Metal Surface Treatment Technology Association Kogakuin University (Shinjuku campus)
    How to plate the substrates that can't be treated easily (aluminum, magnesium)? Tomo Moriguchi
    2018/7/27 Summer Training Seminar(Ⅰ) The Surface Finishing Society of Japan Tokyo University of Science (Noda campus)
    Analysis and control methods for plating solutions? Shingo Nishiki
    2018/8/31 Summer Seminar(III) The Surface Finishing Society of Japan Kanagawa University, Yokohama campus
    To produce new added-values by plating on plastic Koji Kita
    2018/9/1 Training Course for Super-engineers in the Next Generation University of Toyama, Industry-university Collaboration Promotion Center for Research Initiative, Office for Training Course for Super-engineers in the Next Generation University of Toyama,Toyama-city New Technology Promotion Center
    Development of Plating on Plastic Process Using Acidic Permanganate Etching Solution Shingo Nagamine
    2018/9/13 138th Lecture The Surface Finishing Society of Japan Hokkaido University of Science
    Plating Selectivity of Advanced Plating Process on Plastic, Without Using Hexavalent Chromium and Palladium Shingo Nagamine
    2018/9/13 138th Lecture The Surface Finishing Society of Japan Hokkaido University of Science
    Effect on fatigue strength by composition and inner stress of electroless nickel-phosphorus deposits Ryuji Saito
    2018/9/13 138th Lecture The Surface Finishing Society of Japan Hokkaido University of Science
    Basis and applications about electroless nickel plating Kei Hashizume
    2018/9/18 2018 Kansai seminar, Wet Plating (Basic) The Surface Finishing Society of Japan (Kansai) Osaka Research Institute of Industrial Science and Technology (Morinomiya Center)
    Technical trend of aluminum surface finishing Ayumi Hongo
    2018/9/27 Plating seminar, September 2018 The Surface Finishing Society of Japan HORIBA Group Premium Hall
    Why? series (About electroless plating) Kei Hashizume
    2018/10/25 Why? Series Japan Surface Finishing Suppliers Association WINC AICHI
    Electroless nickel/palladium/gold plating applicable to micro-current Toshiya Murata
    2018/11/6 Plating seminar, November 2018 The Surface Finishing Society of Japan HORIBA Group Premium Hall
    Proposal Of Advanced Electroless Copper Plating Technology By Focusing On Crystal Continuity Yuki Kuribayashi
    2018/11/12 Embedded Passive and Active Deviices Technical Committee, Public seminar, 3rd, 2018 The Japan Institute of Electronics Packaging Kairo Kaikan
    High-corrosion resistant treatments for anodized aluminum Takamitsu Tsujimoto
    2018/11/21 20th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan (Kansai) Konan University (Port Island campus)
    Anti-rust films for Zn-Ni/SiO2 composite plating from acidic bath Masafumi Nozaki
    2018/11/21 20th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan (Kansai) Konan University (Port Island campus)
    Plating Process to Polyamide Substrates (PA6) with High Adhesion Michiko Tamura
    2018/11/21 20th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan (Kansai) Konan University (Port Island campus)
    Plating Process for Magnesium and Aluminum Kenji Hara
    2019/1/10 68th Meeting Nanoplating Study Group Ota City Industrial Plaza (PiO)
    Development of Electroless Ni-P Plating film for Power Modules Norihiko Hasegawa
    2019/1/29 25th Mate2019 Smart Processing Society for Mareials, Environment & Energy PACIFICO YOKOHAMA
    Plating Process on Plastics fpr Next Generation, "TOP ZECROM PLUS PROCEE" Shingo Nagamine
    2019/1/30 New Product / Technology Presentation Conference Japan Surface Finishing Suppliers Association TOKYO BIG SITE
    Aluminum Roughening Process for Resin Bonding, "TOP HG BONDING PROCESS" Ayumi Hongo
    2019/1/30 New Product / Technology Presentation Conference Japan Surface Finishing Suppliers Association会 TOKYO BIG SITE
    Why? series (About electroless plating) Kei Hashizume
    2019/2/1 Why? Series Japan Surface Finishing Suppliers Association TOKYO BIG SITE
    Introduction of Electroless Nickel Plating and New Products Kei Hashizume
    2019/2/15 Study Meeting Surface Finishing Technology Study Group of Fukushima Bohata Hot Spring, Yahataya
    New Product Information of Electroless Nickel Plating Solution Kei Hashizume
    2019/2/20 Meeting of Meitokai in February Plating Industries Association of Aichi MEKKI KAIKAN (Nagoya)
    Introduction of Electroless Nickel Plating and New Products Kei Hashizume
    2019/3/1 Youth Division Study Session Plating Industries Association of Kanagawa Kanagawa Small Enterprises Center
    Effect of Electroless Copper Plating Process on Crystal Continuity of Via Bottom Yuhei Kitahara
    2019/3/11 33th Spring Lecture The Japan Institute of Electronics Packaging Takushoku University, BUNKYO CAMPUS
    Eco-friendly Electroless Plating Technology Toshiya Murata
    2019/3/13 Meeting in March, 2019 Electroplating Society OSAKA MEKKI KAIKAN
    Functional Evaluation of Acidic Zn-Ni-SiO2 Composite Plating Masafumi Nozaki
    2019/3/18 139th Lecture The Surface Finishing Society of Japan Kanagawa University, Yokohama campus
    Effect of Composition and Internal Stress of Electroless Ni-P Plating Film on Fatigue Strength Ryuji Saito
    2019/3/18 139th Lecture The Surface Finishing Society of Japan Kanagawa University, Yokohama campus

    2017

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Development of nickel-phosphoru plating solutions for power devices excellent in solder wettability and heat resistance Norihiko Hasegawa
    2017/6/7 JPCA Show NPI Presentation Japan Electronics Packaging and Circuits Association TOKYO BIG SITE
    Electroless copper plating to MID with LDS Hidekazu Honma
    2017/8/30 MES2017 The Japan Institute of Electronics Packaging Chukyo University (Nagoya campus)
    Analysis and control methods for plating solutions? Shingo Nishiki
    2017/8/31 Summer Seminar(III) The Surface Finishing Society of Japan Kanagawa University, Yokohama campus
    Development of Nickel-phosphoru Plating Bathes, Excellent in Fine-Pattern Performance and Corrosion Resistance Hiroki Seto
    2017/9/15 136th Lecture The Surface Finishing Society of Japan Kanazawa Institute of Technology
    Electroless Nickel Plating (Basic and Application) Kei Hashizume
    2017/9/22 Kansai Seminar 2017 (Basic for Wet Plating) The Surface Finishing Society of Japan (Kansai) Osaka Reserach Institute of Industrial Science and Technology (Morinomiya Center)
    Why? series (About Plating Chemicals) Shingo Nishiki
    2017/10/19 Why? series (12th Seminar, Sendai) Japan Surface Finishing Suppliers Association Tokyo Electron Hall Miyagi
    Electroless Nickel-phosphorus Plating to Form Fine Patterns Hiroki Seto
    2017/10/26 Shuzenji Workshop The Japan Institute of Electronics Packaging Laforet Shuzenji
    Sunlight-resistant improving technology for anodized and dyed aluminum substrates Ayumi Hongo
    2017/11/17 19th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan (Kansai) Konan University (Port Island campus)
    Effect on Dissolution Amount by Potential of Bright-nickel Plating Films Seiya Goto
    2017/11/17 19th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan (Kansai) Konan University (Port Island campus)
    Plating Technology On Plastic, Challenge Not To Use Hexavalent Chromium and To Strengthen Corrosion Resistance Koji Kita
    2017/11/21 Plating Seminar (Nov. 2017) The Surface Finishing Society of Japan HORIBA Hakaru LAB
    Latest Surface Treatment Technology for Black Colors (By Wet Method) Tashimtsu Nagao
    2017/12/5 Kansai Plating Symposium 2017 Electroplating Society and NIKKAN KOGYO SHIMBUN NIKKAN KOGYO SHIMBUN,LTD. (Osaka branch)
    Effect on Acid Copper Plating Properties by Equipment and Substrates Hidetoshi Ogura
    2018/1/16 31thLecture for Advanced Plating Technology The Surface Finishing Society of Japan Kairo Kaikan
    Sunlight-resistance Improver for Anodized and Dyed Aluminum Substrates, TAC SUNBLOCK 88 Tomo Moriguchi
    2018/2/14 Surface Treatment Seminar with Latest Producuts and Technologies Japan Surface Finishing Suppliers Association TOKYO BIG SITE
    Advanced Plating Process for Plastic not using hexavalent chromium and palladium Shingo Nagamine
    2018/2/14 Surface Treatment Seminar with Latest Producuts and Technologies Japan Surface Finishing Suppliers Association TOKYO BIG SITE
    Why? series (About plating chemicals) Shingo Nishiki
    2018/2/16 Why? series (12th Seminar, Tokyo) Japan Surface Finishing Suppliers Association TOKYO BIG SITE
    Blackening Treatment Technology by Plating Methods Jun-ichi Katayama
    2018/3/7 Electroplating Research Seminar (March, 2018) Electroplating Society Osaka-fu Mekki Industrial Association
    Advanced Plating Process for Plastic Not Using Hexavalent Chromium and Palladium Shingo Nagamine
    2018/3/12 137th Lecture The Surface Finishing Society of Japan SHIBAURA INSTITUTE OF TECHNOLOGY, TOYOSU CAMPUS

    2016

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Black-color Trivalent Chromium- and Alloy-Plating Tashimtsu Nagao
    2016/4/13 Seminar (April, 2016) Tokakai, Japan Plating Society Bunkyo-ku Plating Center (Tokyo)
    Electroless Nickel-phosphorus Plating to Form Fine Patterns Hiroki Seto
    2016/9/8 MES2016 The Japan Institute of Electronics Packaging Chukyo University (Nagoya campus)
    Surface Finishing Process to Form Ultra-fine Patterns Yuki Tsuno
    2016/9/8 MES2016 The Japan Institute of Electronics Packaging Chukyo University (Nagoya campus)
    Porous Film Forming Methods and Its Effects on Joint Strength to Resin Makoto Horikawa
    2017/2/17 102th Symposium The Japan Institute of Light Metals Kogakuin University (Shinjuku campus)
    Blackening-treatment and Anti-tarnish Agents for Copper Substrates Hiroaki Sakai
    2017/2/22 41th Analysis Exhibition and Technical Lectures Osaka Industrial Research Association Osaka Municipal Technical Research Institute
    electroless Ni-P plating films Norihiko Hasegawa
    2017/3/7 31th Spring Lecture The Japan Institute of Electronics Packaging Keio Keio University (Yagami campus)
    High-corrosion Resistant Sol-coating Solution for Plating on Plastic Saori Takeuchi
    2017/3/10 135th Lecture The Surface Finishing Society of Japan Toyo University (Kawagoe campus)

    2015

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Blackening-treatment for Copper Substrates to Realize High Adhesion and Smoothness Performance Hiroaki Sakai
    2015/9/3 MES2015 The Japan Institute of Electronics Packaging OSAKA UNIVERSITY, Suita campus
    Nickel-free Sealing Process for Anodized and Dyed Aluminum Kenji Hara
    2015/9/9 132th Lecture The Surface Finishing Society of Japan Shinshu University, Nagano campus
    Plating on Plastic (Basic) and Its Latest Technology Takashi Matsunami
    2015/9/16 2015 Kansai seminar The Surface Finishing Society of Japan (Kansai) Osaka Municipal Technical Research Institute
    Plating Methods on Plastic Without Using Chromium Acid Shingo Nishiki
    2015/10/8 Eco-friendly Technology for Chemical- and Wastewater-treatments Japan Surface Finishing Suppliers Association Tokyo Metropolitan Small and Medium Enterprise Support Center
    Electroless Plating Process for MID with LDS Midori Tatsuta
    2015/10/30 13th Seminar Japan MID Association Institute of Industrial Science, The University of Tokyo
    To Abolish Defects From Aluminum Anodizing and Dyeing Lines Kenji Hara
    2015/11/9 Light Metal Surface Treatment Technology Association, 310th Seminar The Surface Finishing Society of Japan Ota City Industrial Plaza (PiO)
    100 Questions and Answers About Aluminum Surface Technology Kenji Hara
    2015/11/19 Light Metal Surface Treatment Technology Association, Seminar The Surface Finishing Society of Japan Ota City Industrial Plaza (PiO)
    Plating Processes on Magnesium and Aluminum Kenji Hara
    2015/11/28 2015 Discussions JAPAN Research Institute of Material Technology KINDAI University
    For Advanced Surface Treatments, From Hexavalent-chromium Free to Ultra-micro Pattern Formation Kuniaki Otsuka
    2016/1/27 SURTECH 2016, Special Seminar ICS Convention Design TOKYO BIG SITE
    Formation To Deposition Of Oxide Semiconductors Kuniaki Otsuka
    2016/3/3 Research Seminar Research Society for Biotemplate Technology Tokyo Institute of Technology (Tamachi campus)
    Technical Trends For Next Generation From Okuno's Newly Developed Products Kuniaki Otsuka
    2016/3/16 Material Exihibition to Support Innovation (2016) The Chemical Daily Co., Ltd. Mydome Osaka
    High-corrosion Resistant Process Using Tin-nickel Alloy Plating Takamitsu Tsujimoto
    2016/3/21 133th Lecture The Surface Finishing Society of Japan Waseda University (Nishi-Waseda Campus)
    High-corrosion Resistant Process by Electroless Nickel-phosphorus/Gold Plating Hiroki Seto
    2016/3/22 30th Spring Lecture The Japan Institute of Electronics Packaging Tokyo Institute of Technology (Oh-okayama Campus)

    2014

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Current Problem and Future Possibilities About Trivalent Chromium Plating Jun-ichi Katayama
    2014/6/27 Plating Seminar (June, 2014) The Surface Finishing Society of Japan Tokyo Metropolitan Small and Medium Enterprise Support Center
    Electroless Copper Plating Process Using Nano-silver Catalysts Yuu Shimizu
    2014/9/4 MES2014 The Japan Institute of Electronics Packaging OSAKA UNIVERSITY, Suita campus
    Acid Copper Plating Additives For Via-filling To Satisfy Various Requirements Akihiro Oishi
    2014/9/4 MES2014 The Japan Institute of Electronics Packaging OSAKA UNIVERSITY, Suita campus
    Final Surface Treatments Suitable For Gold-wire Bonding Yasuhiro Tanabe
    2014/9/3 Electronics Device Mounting Study Group, 7th Seminar Smart Processing Society for Materials, Environmental & Energy in Electronics OSAKA UNIVERSITY
    Porous film forming additives Masahiko Ikeda
    2014/9/9 19th Work Shop for film formation SEEDS & NEEDS Association Advanced Industrial Science and Technology, AIST Tokyo Waterfront
    Effect by Heat-treatment Conditions And Friction Coefficiency Regarding Electroless SiC-composit Nickel-phophorus Deposits Yuka Iwamoto
    2014/9/22 130th Lecture The Surface Finishing Society of Japan Kyoto University (Yoshida Campus)
    Possibilities of Gold-free Final Surface Treatments Yasuhiro Tanabe
    2014/11/18 Printer Device Mounting Study Group The Japan Institute of Electronics Packaging Tokyo University
    Possibilities of Gold-free Final Surface Treatments Yasuhiro Tanabe
    2014/12/16 Solder and smart jointing division, Symposium The Japan Welding Engineering Society Welding Kaikan Hall
    Lead-free, Black-color Electroless Nickel-phosphorus Plating Solution Toru Morimoto
    2015/1/28 Lectures for the Latest Products and Technology Japan Surface Finishing Suppliers Association TOKYO BIG SITE
    Eco-friendly, Black-color Electroless Nickel-phosphorus Plating Solution Jun-ichi Nakazato
    2015/2/17 39th Analysis Exhibition and Technical Seminars Osaka Industrial Research Association Osaka Municipal Technical Research Institute
    Copper-tin Plating From Copper (I) Complex Bath Without Using Cyanides Takamitsu Tsujimoto
    2015/3/4 131th Lecture The Surface Finishing Society of Japan Kanto Gakuin University (Yokohama Kanazawa-Hakkei Campus)
    Electroless Plating Process for Isolated Patterns on Si Wafer Akihiro Mori
    2015/3/16 29th Spring Lecture The Japan Institute of Electronics Packaging Tokyo University, Hongo Campus

    2013

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Latest Additive of Acid Copper Plating for PWB, Designed for Higher Current Density Tashimtsu Nagao
    2013/4/10 International Conference on Electronics Packaging 2013(ICEP 2013) The Japan Institute of Electronics Packaging Osaka International Convention Center
    History And Points Regarding Aluminum Dyeing Technics Yutaka Nkagishi
    2013/5/15 Light Metal Surface Treatment Technology Association The Surface Finishing Society of Japan Ota City Industrial Plaza (PiO)
    Electroless Plating Treatment Process for PWB with Isolated Patterns Hidekazu Honma
    2013/6/6 JPCA Show 2013 NPI Presentation Japan Electronics Packaging and Circuits Association TOKYO BIG SITE
    Orientation Control in Magnetic Microcoils From Spiral Algaes and its THz-wave responses Azusa Kita
    2013/7/12 59th Research study by the Society of Polymer Science, Japan The Society of Polymer Science, Japan, Kansai Regional Chapter Hyogo Kenmin Kaikan
    Electroless PTFE-composite Nickel-phophorus Deposits Kei Hashizume
    2013/7/17 46th Seminar Nano-plating Research Association FORUM 246 (Kanagawa)
    Thin Layer From Polysilsesquioxane Containing Palladium Catalysts To Form Electroless Copper Deposits Sayuri Tejima
    2013/8/1 11th lecture The Japanese Sol-Gel Society Hiroshima University (Higashi-hiroshima Campus)
    Electroless Coper Plating To Utilize For Printed Electronics Tomo Moriguchi
    2013/9/12 MES2013 The Japan Institute of Electronics Packaging OSAKA UNIVERSITY, Suita campus
    Electroless Nickel/Gold Plating Process For PWBs Tomomi Aoki
    2013/9/12 MES2013 The Japan Institute of Electronics Packaging OSAKA UNIVERSITY, Suita campus
    Solder-joint and Wire-bonding Performance Evaluation about Electroless Nickel-phosphorus Plating Films Tomomi Aoki
    2014/2/4 Mate 2014 Japan Welding Society PACIFICO YOKOHAMA
    Acid Copper Plating Additives For Via-filling To Realize High-performance Tomoyuki Shiono
    2014/3/6 28th Spring Lecture The Japan Institute of Electronics Packaging Takushoku University, BUNKYO CAMPUS
    Electroless Coper Plating To Utilize For Printed Electronics Tomo Moriguchi
    2014/3/13 129th Lecture The Surface Finishing Society of Japan Tokyo University of Science (Noda campus)

    2012

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Additives for Zinc / nickel Alloy Plating, New Product Introduction (Trivalent Chromate Agents) Yorishige Fukuda
    2012/4/27 April Seminar (New product introduction) Plating Association for Youth Osaka-fu Mekki Industrial Association
    Discoloration Preventing Treatment for Ag Plating by Using ZnO layers Tomomi Aoki
    2012/4/27 Special seminar in spring Aluminum Finishing Society of Kinki HOTEL AWINA OSAKA
    Plating on Plastic Kuniaki Otsuka
    2012/5/10 45th Advanced Surface Finishing Technology Seminar Hightechno Co., Ltd. Hightechno Co., Ltd.
    The Latest Surface Treatment Technology for Via-filling Plating (From Build-up PWBs to TSV) Shingo Nishiki
    2012/6/13 2012 The Latest Packaging Technology Symposium, Material Session The Japan Institute of Electronics Packaging TOKYO BIG SITE
    New Surface Treatment Technology Demanded For LED Light Reflector Jun-ichi Katayama
    2012/6/20 Surface Physical Property Study Group The Surface Finishing Society of Japan, (Kansai) Osaka Municipal Technical Research Institute
    Trivalent Chromium Plating Shingo Nagamine
    2012/8/3 Summer Training Seminar The Surface Finishing Society of Japan Tokyo University of Science (Noda Campus)
    Precious-metal Plating, Alloy Plating Katsushige Iwamatsu
    2012/9/7 Corrosion Control School, Training Seminar Japan Association Of Corrosion Control Osaka Science & Technology Centerr
    TOP MRS PROCESS Tomomi Aoki
    2012/9/12 MES2012 The Japan Institute of Electronics Packaging Osaka Prefecture University (Nakamozu Campus)
    Characters of Black-color Cobalt-chromium Alloy Plating Films Shingo Nagamine
    2012/9/27 126th Lecture The Surface Finishing Society of Japan Muroran Institute of Technology
    Plating Proceses on Magnesium Alloys Kenji Hara
    2012/9/28 The latest surface treatment technology for magnesium alloys (2012) The Japan Magnesium Association Edo Tokyo Museum
    Development of the latest high-performance acid copper plating additives for Via-Filling & PTH. Shingo Nishiki
    2012/10/11 ISMP2012(The 11th International Symposium on Microelectronics and Packaging) KMEPS,IMAPS-Japan,IMAPS-ALC KINTEX Convention hall (Korea)
    Present and Future Surface Treatment Technology Katsushige Iwamatsu
    2012/10/19 Technical Seminar (2012) New Material Technology Research Association (Shizuoka Prefecture) Industrial Research Institute of Shizuoka Prefecture
    New Surface Treatment Technology Demanded For LED Light Reflector Jun-ichi Katayama
    2012/10/24 56th seminar The Japan Institute of Electronics Packaging Kairo Kaikan
    PTFE-composite Nickel Plating Technology and Current Problems Katsushige Iwamatsu
    2012/10/29 Study for Plating, October Seminar The Surface Finishing Society of Japan Tokyo Metropolitan Small and Medium Enterprise Support Center
    Porous Plating Katsushige Iwamatsu
    2013/1/30 Special Seminar in SURTECH 2012 The Surface Finishing Society of Japan TOKYO BIG SITE
    Eco-friendly Trivalent Chromium Plating Solutions Jun-ichi Katayama
    2013/2/20 37th Analysis Exhibition and Technical Lectures Osaka Industrial Research Association Osaka Municipal Technical Research Institute

    2011

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Product Introduction (TOP FINECHROME BR/WR, TOP SOFT COPPER) Hidetaka Tsujibayashi
    2011/4/21 Product Introduction Seminar Plating Association for Youth Osaka-fu Mekki Industrial Association
    New Surface Treatment Technology Demanded For LED Light Reflector Jun-ichi Katayama
    2011/4/27 General Meeting and Lecture Electroplating Society Osaka-fu Mekki Industrial Association
    Plating on Plastic Kuniaki Otsuka
    2011/5/12 Advanced Vocational Training School for Plating Hightechno Co., Ltd. Keihin-jima, Tokyo
    Present Situation and Problems about Trivalent Chromium Plating Jun-ichi Katayama
    2011/5/19 Meito-kai Meito-kai Aichi-ken Mekki Kaikan
    New Surface Treatment Technology Demanded For LED light reflector Jun-ichi Katayama
    2011/5/24 5th Seminar About Future Plating Technology The Surface Finishing Society of Japan Kanto Gakuin University
    Sulfide- and Heat-resistant Laminated Structure For LED Light Reflectors Tomomi Aoki
    2011/9/8 MES2011 The Japan Institute of Electronics Packaging Kansai University (Senriyama Campus)
    Precious-metal Plating, Alloy Plating Kuniaki Otsuka
    2011/9/8 51th Corrosion Control School, Training Seminar Japan Association Of Corrosion Control Osaka Science & Technology Centerr
    Heat-resistant Laminated Structure For LED Light Reflectors Tomomi Aoki
    2011/9/21 124th Lecture The Surface Finishing Society of Japan Nagoya University (Higashiyama Campus)
    Nickel-free Sealing Solution for Anodized and Dyed Aluminum Msayuki Sakoguchi
    2011/9/21 124th Lecture The Surface Finishing Society of Japan Nagoya University (Higashiyama Campus)
    Possibilities about Industrial use of Trivalent Chromium Plating Shingo Nagamine
    2011/10/26 Plating Seminar (Oct. 2017) The Surface Finishing Society of Japan Tokyo Metropolitan Small and Medium Enterprise Support Center
    Direct Electro-copper Plating Process on Plastic and Its Current Problems Takashi Matsunami
    2011/10/27 Nano-plating Research Association Nano-plating Research Association Keio University (Hiyoshi campus)
    Nickel-free Sealing Technology for Anodized and Dyed Aluminum Katsushige Iwamatsu
    2011/11/11 28124th Anodizing Research Society The Surface Finishing Society of Japan Hotel Kitano Plaza, Rokko-so
    Discoloration Preventing Treatment for Ag Plating by Using ZnO layers Tomomi Aoki
    2011/11/29 13124th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan (Kansai) Campus Plaza Kyoto
    Plating on Materials That Can't Be Plated Easily Kuniaki Otsuka
    2011/12/22 Advanced Vocational Training School for Plating (19th,Osaka) Osaka-fu Mekki Industrial Association Osaka-fu Mekki Industrial Association Kaikan
    New Surface Treatment Technology Demanded For LED light reflector Kuniaki Otsuka
    2012/1/20 Functional Plating Technology Study Association for Next Generation Kyoto Research Park Osaka Municipal Technical Research Institute
    Sulfide- and Heat-resistant Laminated Structure For LED Light Reflectors Jun-ichi Katayama
    2012/1/20 41th INTERNEPCON Japan, Special Technology Seminar Reed Exhibitions Japan Ltd. TOKYO BIG SITE
    Current Situation and Future of Plating Technology Katsushige Iwamatsu
    2012/1/28 135th Electronic Ceramic Process Meeting Electronic Ceramic Process Meeting Yokohama Port Opening Memorial Hall
    Laminate Structure for LED Light by Using ZnO layers Tomomi Aoki
    2012/2/17 8th Technology Seminar, The Latest Packaging Technology For Earth Protection The Japan Institute of Electronics Packaging (Kansai) OSAKA UNIVERSITY, Nakanoshima center
    Additive for Acid Copper Plating to Realize High-throwing Power Kazuhiro Hirooka
    2012/3/7 26th Lecture The Japan Institute of Electronics Packaging Chuo University (Kourakuen Campus)
    Electroless Copper Plating Solution For PWB with Isolated Circuits Hidekazu Honma
    2012/3/7 26th Lecture The Japan Institute of Electronics Packaging Chuo University (Kourakuen Campus)
    Laminate Structure for LED Light by Using ZnO layers Tomomi Aoki
    2012/3/8 New Frontier Material Association Osaka Industrial Research Association KKR Hotel Osaka

    2010

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Acid Copper Additives for Via-filling and Its Current Situations Takashi Matsunami
    2010/4/16 3326th Seminar Nano-plating Research Association Keio University (Hiyoshi Campus)
    Plating on Plastic Kuniaki Otsuka
    2010/4/22 4326th Senior Surface Treatment Seminar Hightechno Co., Ltd. Tokyo, Keihin-jima
    Dyeing, Plating Kenji Hara
    2010/5/14 Surface Treatment Seminar About Aluminum Aluminum Finishing Society of Kinki Hotel Awina Osaka
    Surface Treatment Technology for Aluminum Die-casting Materials Masaaki Sakaguchi
    2010/7/27 30th Summer seminar The Surface Finishing Society of Japan, Light Metal Surface Treatment Technology Association Kogakuin University (Shinjuku Campus)
    Electroless Ni/Pd/Au Plating Process Katsushige Iwamatsu
    2010/8/27 Study Group for the Youth The Japan Institute of Electronics Packaging (Kansai) Konan University (Port Island Campus)
    To Realize Uniform Macro-throwing Power in Via-filling Plating Shingo Nishiki
    2010/11/30 Fukuoka-Nagano Cluster Matching Forum (2010) Nagano Techno Foundation (Main organizer) Shinshu Universit, Fiber Engineering
    Effects by Material Surface Reforming in Plating on Plastic Tsuyoshi Kitabayashi
    2010/12/2 12th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan Kyoto University (Uji Ohbaku Plaza)
    Electroless Plating (Basic and Application) Katsushige Iwamatsu
    2010/12/11 Human Resource Development Symposium For Plating, Questions & Answers Center of Iizuka Research and Development ACROS Fukuoka
    Zinc Plating and Its Corrosion Resistance Jun-ichi Katayama
    2010/12/11 Human Resource Development Symposium For Plating, Questions & Answers Center of Iizuka Research and Development ACROS Fukuoka
    Plating on Materials That Can't Be Plated Easily Kuniaki Otsuka
    2010/12/22 Advanced Vocational Training School for Plating (18th, Osaka) Osaka-fu Mekki Industrial Association Osaka-fu Mekki Industrial Association Kaikan
    Okuno's Advanced Technology and Business Strategies Kuniaki Otsuka
    2011/3/11 2nd Green Nano Forum Osaka Municipal Technical Research Institute Sansoukan (Osaka)
    Discoloration Preventing Treatment for Ag Plating by Using oxide layers Tomomi Aoki
    2011/3/17 123th Lecture The Surface Finishing Society of Japan Kanto Gakuin University (Kanazawa Hakkei Campus)

2018

Title Presentator
Date Name of presentation Organizer Place of presentation
Environmentally-Friendly PWB Manufacturing Methods Not Including Etching Steps -5- Takashi Kato
2018/9/7 MES2018 The Japan Institute of Electronics Packaging OSAKA UNIVERSITY, Suita campus

2017

Title Presentator
Date Name of presentation Organizer Place of presentation
Company and Product Introduction by Okuno and New Product Introduction (Functional Thin Coating Solution) Takashi Kato
2017/8/25 New Frontier Material Association Osaka Industrial Research Association Osaka Research Institute of Industrial Science and Technology (Morinomiya Center)
Decoration using GLASS COLOR (Glass Enamels for Firing) Takashi Kato
2017/11/15 Technical Seminar GLASS MANUFACTURERS' ASSOCIATION OF JAPAN Japan Glass Industry Center
Rust-preventing Treaments for Aluminum Substrates by Silica-base Thin Coating Ippei Tanigawa
2017/11/17 19th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan Konan University (Port Island Campus)
Environmentally-Friendly PWB Manufacturing Methods Not Including Etching Steps -4- Takashi Kato
2018/3/6 32th Spring Lecture The Japan Institute of Electronics Packaging Tokyo University of Science (Noda Campus)
Rust-preventing Effect and Mechanism of Silica-base Thin Coating on Aluminum Alloys Ippei Tanigawa
2018/3/12 137th Lecture The Surface Finishing Society of Japan Shibaura Institute of Technology (Toyosu Campus)

2016

Title Presentator
Date Name of presentation Organizer Place of presentation
GLASS COLOR for Firing Takashi Kato
2016/6/9 General Meeting Print Glass Manufacturers' Association of Japan Japan Glass Industry Center
Thin Silica Film Coating 「Protector」 Series Koichiro Murahashi
2016/6/24 SURFACE & COATINGS 2106 SURFACE & COATINGS (Thai) Bangkok International Trade & Exhibition Center (BITEC)
Development of GLASS COLOR for Firing, High-corrosion Resistant Coating Solution By Sol-gel Method Koichiro Murahashi
2016/8/8 14th Seminar The Japaneses Sol-Gel Society Waseda University (Nishi-waseda Campus)
Development of High-corrosion Resistant Coating Solution By Sol-gel Method Teruhiko Kagehisa
2016/9/2 134th Lecture The Surface Finising Society of Japan Tohoku University (Kawauchi-kita campus)
Black-color Surface Treatment Technology From Organic/Inorgamic Pigments Koichiro Murahashi
2016/11/14 Division of Functional Dye Chemistry, Division of Electronics, Joint-Seminar Kinki Chemical Society Japan Osaka Science & Technology Centerr
Anti-rust Technology by Silica-base Thin Layers (Protector Series) Takashi Kato
2017/2/15 Surface Treatment Seminar with the Latest Producuts and Technologies Japan Surface Finishing Suppliers Association TOKYO BIG SITE

2015

Title Presentator
Date Name of presentation Organizer Place of presentation
Development of High-corrosion Resistant Silica-type Coating Solution By Sol-gel Method Katsumasa Shimahashi
2016/2/17 41th Analysis Exhibition and Technical Lectures Osaka Industrial Research Association Osaka Municipal Technical Research Institute

2014

Title Presentator
Date Name of presentation Organizer Place of presentation
Overcoat Glass For LED Substrates In Next Generation Tomonobu Yokomichi
2014/9/4 MES2014 The Japan Institute of Electronics Packaging OSAKA UNIVERSITY
Thermosetting Pastes Developed For Underlayers of Electroless Plating Yuki Tsuno
2014/9/4 MES2014 The Japan Institute of Electronics Packaging OSAKA UNIVERSITY

2013

Title Presentator
Date Name of presentation Organizer Place of presentation
Development Of Organic-Inorganic Hybrid Thin Layers As Catalyst Layer For Electroless Copper Plating Sayuri Tejima
2013/11/28 15th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan Okayama University 50th Anniversary Memorial Hall
Impacts on FET Properties by Temperature Change Regarding Solution-processed Liquid Crystalline Organic Semiconductors, C8-BTBT Masaomi Kimoto
2013/9/8 Session 2013 The Japanese Liquid Crystal Society OSAKA UNIVERSITY (Toyonaka Campus)
Organic FET Formation Using Screenprinting For Imaging Electrodes Masaomi Kimoto
2013/9/16 The 74th Autumn Meeting, 2013 The Japan Society Of Applied Physics Doshisya University (Kyotanabe campus)
Low-expansion Glass For Low-temperature Firing Isao Toda
2014/3/7 28th Spring Lecture The Japan Institute of Electronics Packaging Takushoku University, BUNKYO CAMPUS

2012

Title Presentator
Date Name of presentation Organizer Place of presentation
Impacts on FET Properties by Temperature Change Regarding Solution-processed Liquid Crystalline Organic Semiconductors, 8TNAT8 Masaomi Kimoto
2012/9/5 Session 2012 The Japanese Liquid Crystal Society Chiba University (Nishi-chiba Campus)
Forming Application-type Organic FET by Using Solution-processed Liquid Crystalline Organic Semiconductors, 8TNAT8 Masaomi Kimoto
2012/9/11 The 73th Autumn Meeting, 2012 The Japan Society Of Applied Physics Ehime University, Matsuyama University
Forming Transparent Electrodes and Their Properties by Screen Printing Yasutaka Takemura
2012/10/25 Inovation Initiative, The 2nd Printed Electronics Research Association Kyoto Research Park Osaka Municipal Technical Research Institute
Effect by Heat Treatment Conditions on TiO2 Thin Layers Formed By Screen Printing Tomonobu Yokomichi
2012/11/30 14th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan Kyoto University (Uji Ohbaku Plaza)
Application-type Bottom-contact Organic FET by Using Liquid Crystalline Organic Semiconductors Masaomi Kimoto
2013/3/13 27th Spring Lecture The Japan Institute of Electronics Packaging Tohoku University (Kawauchi-kita Campus)
Development of High-corrosion Resistant Coating Solution For Zinc Plating Films By Sol-gel Method Masafumi Nozaki
2013/3/19 127th Lecture The Surface Finishing Society of Japan Nippon Institurte Of Technology (Miyashiro Campus)

2011

Title Presentator
Date Name of presentation Organizer Place of presentation
Development of Transparent Conductive Film by the Use of Metal- oxide Nanoparticle Pastes Koichiro Murahashi
2011/4/15 ICEP2011 The Japan Institute of Electronics Packaging, IEEE, CPMT Shin Koukaido (Nara Prefecture)
Application-type Organic FET by Using Liquid Crystalline Organic Semiconductors Masaomi Kimoto
2011/8/29 The 72th Autumn Meeting, 2011 The Japan Society Of Applied Physics Yamagata University (Koshirakawa Campus)
Forming and Evaluation of Application-type Organic FET by Using Solution-processed Liquid Crystalline Organic Semiconductors, 8TNAT8 Masaomi Kimoto
2011/9/10 Session 2011 The Japanese Liquid Crystal Society Tokyo City University (Setagaya Campus)
Development of Low-expansion Glass For Aluminum Nitride Boards Isao Toda
2011/11/30 13th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan Campus Plaza Kyoto
Forming Transparent Electrode Films by Screen Printing, Using Nano-particle Paste and The Identification Yasutaka Takemura
2012/2/9 Nano-tech Forum 2012 Industrial Technology Institute (Kansai Center) Senri Life Sciece Center

2010

Title Presentator
Date Name of presentation Organizer Place of presentation
Forming Transparent Electrode Films by Screen Printing, Using Metal Oxide Nano-particle Paste Koichiro Murahashi
2010/11/11 82th New Frontier Material Seminar Osaka Industrial Research Association Osaka Industrial Research Association
Development Of High-reflectance Ceramic Materal Junko Matsuki
2010/12/2 12th Surface Finishing Technology Forum (Kansai) The Surface Finishing Society of Japan Kyoto University (Uji Ohbaku Plaza)

    2019

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Effect of grinding treatment on physical properties of wheat protein degradation products Akito Inayoshi
    2019/8/7 2019 Annual Convention Japan Society for Food Engineering KAGAWA INTERNATIONAL HALL
    New Technology about Discoloration Inhibiting Agent to boiled green vegetables Jun Sato
    2019/8/27 2019 Annual Meeting The Japan Society of Cookery Science Nakamura Gakuen University
    New Technology about Discoloration Inhibiting Agent to boiled green vegetables Moe Inoue
    2019/8/29 66th Seminar THE JAPANESE SOCIETY FOR FOOD SCIENCE AND TECHNOLOGY Fuji Women's University (Sapporo)
    Food loss reduction by food addtive Hitoshi Kawata
    2019/10/3 New Challenge Osaka 3 Institute of Industrial Science and Technology (Osaka), Chamber of Commerce and Industry, Association for the Advancement of Manufacturing and Technology Chamber of Commerce and Industry (Osaka)

    2018

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Practical Use Of Emulsifiers And Quality Improvers For Baked Sweets Sumika Kaneko
    2018/5/18 New Food Materials And Additives For Nutritionists Food Chemicals Newspaper Inc. TOKYO BIG SITE

    2017

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Gluten-free Food And Its Marketability Katsuyuki Tanaka
    2017/4/8 1st Seminar, 2017 Japan Pan Association Kobe Yamate University
    Effect On Wheat Gluten Properties By Smoking Jun Sato
    2017/8/29 64th Seminar, 2017 The Japanese Society For Food Science And Technology Nihon University (Shonan Campus)
    Tasty Low-salt Food By Smoked Patassium Masaki Mine
    2017/10/5 Exhibitor Presentation UBM Japan Co Ltd TOKYO BIG SITE
    Food Quality Improvers For Confectionery And Bread Katsuyuki Tanaka
    2017/12/2 172th Seminar Japanese Society for Cereal Scientists Kobe Women's University
    Development of POTASHIO OD For Low-salt Food Yuki Kitano
    2018/2/21 42th JASIS, Conference and Seminar Osaka Industrial Research Association Osaka Research Institute of Industrial Science and Technology (Morinomiya Center)

    2016

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Development And Application of POTASHIO OD For Low-salt Food Yuki Kitano
    2016/5/20 Tasty Low-saly Project, 2016 Food Chemicals Newspaper Inc. TOKYO BIG SITE
    Sensory Evaluations For Chocolate Jun Sato
    2016/2/29 65th Seminar Japanese Society For Sensory Evaluation Union Of Japanese Scientists And Engineers Building (No.3)

    2015

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Prevention of Blood Sugar Increase By Acidic Polysaccharides From Seaweed Kazuyasu Iwasaki
    2015/5/14 69th Seminar Japan Society of Nutrition And Food Science PACIFICO YOKOHAMA
    Quality Improving Effects of Gluten Extracted From Yomechikara (Japan-made Very Strong Flour) Tameaki Ando
    2015/8/28 62th Seminar, 2015 The Japanese Society For Food Science And Technology Kyoto University

    2014

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    New Taste Improvers For Less-, Low-salt Food Yuki Kitano
    2014/5/21 Quality And Taste Improvers For Less-, Low-salt Food, 2014 Science Forum Rainbow Hill
    Sensory Evaluations For Orange Juice By Ordering Jun Sato
    2014/7/22 48th Seminar Japanese Society For Sensory Evaluation Union of Japanese Scientists And Engineers Building (No.3)
    New Taste Improvers For Less-, Low-salt Food (Backgroung and Features) Yuki Kitano
    2014/11/28 2nd Seminar Osaka Municipal Technical Research Institute Osaka Municipal Technical Research Institute
    Softening Technology For Processed Meat For Nursing Meal Naoya Kuzutani
    2015/2/1 Seminar For Nursing Meal Osaka Municipal Technical Research Institute Osaka Municipal Technical Research Institute
    Prevention of Blood Sugar Increase By Acidic Polysaccharides From Seaweed Kazuyasu Iwasaki
    2015/3/26 Seminar,2015 Japan Society For Bioscience, Biotechnology, and Agrochemistry Okayama University (Tsushima Campus)

    2013

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Effectivel Use Of Defatted Rice Bran By Roasting Technology Kenta Suzuki
    2013/7/31 90th Seminar New Frontier Material Association Osaka Municipal Technical Research Institute
    Property Research of Soybean-, Psyllium-mix-gel Tameaki Ando
    2013/8/30 60th Seminar, 2013 The Japanese Society For Food Science And Technology Jissen Women's University
    Food Quality Keeping and Improving Materials Katsuyuki Tanaka
    2013/10/31 Food/Biotechnology Seminar Kyoto Prefecture Small-, Medium-size Company Technology Center Kyoto Prefecture Small-, Medium-size Company Technology Center
    Development Of Anti-discoloration Technology By Using Defatted Rice Bran Extract Kenta Suzuki
    2014/2/19 38th Conference and Seminar Osaka Industrial Research Association Osaka Municipal Technical Research Institute
    Property Research of Soybean-, Psyllium-mix-gel Tameaki Ando
    2014/3/28 Seminar, 2014 Japan Society For Bioscience, Biotechnology, and Agrochemistry Meiji University (Ikuta Campus)

    2012

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Development Of Anti-discoloration Technology By Using Defatted Rice Bran Extract Kenta Suzuki
    2012/5/18 1st Seminar, 2012 Bio-industry Research Association Osaka Municipal Technical Research Institute
    Property Research of Soybean-, Polysaccharide-mix-gel Tameaki Ando
    2013/3/26 Seminar, 2014 Japan Society For Bioscience, Biotechnology, and Agrochemistry Tohoku University

    2010

    Title Presentator
    Date Name of presentation Organizer Place of presentation
    Microorganism Control Technology To Preserve Food Asao Fujigami
    2010/7/1 Microorganism Control Seminar Focusing On Food Spoilage And Food Deterioration Industrial Technology Society JCII Building (Tokyo)
    Effects on Wheat Uncooked Dough Specifications By Oxidase Inhibitor From Rosted Rice Bran Extract Kenta Suzuki
    2010/9/1 57th Seminar, 2010 The Japanese Society For Food Science And Technology Tokyo University of Agriculture
    Effect Of Roasted Rice Bran Extracts And Roasted Soyabean Extracts on Rat Intaking Ethanol Kiyotaka Wada
    2010/9/2 57th Seminar, 2010 The Japanese Society For Food Science And Technology Tokyo University of Agriculture
    Development Of Roasted Rice Bran Extract And Its Practical Use Kenta Suzuki
    2010/12/4 143th Seminar Japanese Society for Cereal Scientists Takatsu Garden
    To Reduce Food Waste By Utilizing Food Additives Hitoshi Kawata
    2011/1/25 Bio-industry Research Seminar, 2nd, 2010 Osaka Municipal Technical Research Institute Osaka Municipal Technical Research Institute

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